TW200740665A - Tray for component packaging - Google Patents

Tray for component packaging

Info

Publication number
TW200740665A
TW200740665A TW096107907A TW96107907A TW200740665A TW 200740665 A TW200740665 A TW 200740665A TW 096107907 A TW096107907 A TW 096107907A TW 96107907 A TW96107907 A TW 96107907A TW 200740665 A TW200740665 A TW 200740665A
Authority
TW
Taiwan
Prior art keywords
tray
component packaging
packaging
component
automatically removed
Prior art date
Application number
TW096107907A
Other languages
Chinese (zh)
Inventor
Ronald P Holler
Original Assignee
Fci Americas Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fci Americas Technology Inc filed Critical Fci Americas Technology Inc
Publication of TW200740665A publication Critical patent/TW200740665A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)
  • Stackable Containers (AREA)
  • Basic Packing Technique (AREA)

Abstract

A tray for component packaging that allows components having varying heights to be automatically removed from the tray.
TW096107907A 2006-03-16 2007-03-07 Tray for component packaging TW200740665A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78277706P 2006-03-16 2006-03-16
US11/410,793 US20070215517A1 (en) 2006-03-16 2006-04-25 Tray for component packaging

Publications (1)

Publication Number Publication Date
TW200740665A true TW200740665A (en) 2007-11-01

Family

ID=38516668

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096107907A TW200740665A (en) 2006-03-16 2007-03-07 Tray for component packaging

Country Status (3)

Country Link
US (1) US20070215517A1 (en)
TW (1) TW200740665A (en)
WO (1) WO2007108880A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7891486B2 (en) * 2006-12-26 2011-02-22 Nihon Dempa Kogyo Co., Ltd. Shipping tray for optical elements, and optical element shipped therein
WO2010036790A1 (en) * 2008-09-25 2010-04-01 Illinois Tool Works Inc. Devices and methods for handling microelectronic assemblies
MY166008A (en) * 2010-03-12 2018-05-21 Illinois Tool Works A strippable hybrid tray system for electronic devices
CN201793171U (en) * 2010-05-07 2011-04-13 富士康(昆山)电脑接插件有限公司 Connector packaging box
TWI486288B (en) * 2011-05-06 2015-06-01 Hon Hai Prec Ind Co Ltd Loading device
CN102774574B (en) * 2011-05-10 2015-11-18 鸿富锦精密工业（深圳）有限公司 Bogey
CN203111734U (en) * 2012-12-14 2013-08-07 鸿准精密模具（昆山）有限公司 Packing mechanism
JP6207194B2 (en) * 2013-03-27 2017-10-04 キヤノン株式会社 Component loading tray
USD748873S1 (en) * 2013-12-04 2016-02-02 Whirlpool Corporation Dishwasher silverware basket
CN103786978B (en) * 2014-01-23 2017-02-01 深圳市华星光电技术有限公司 Liquid crystal display panel packaging structure
KR102308210B1 (en) * 2014-09-19 2021-10-06 삼성전자주식회사 Multi-stepped boat for receiving semiconductor packages
KR102434438B1 (en) * 2017-09-07 2022-08-19 삼성전자주식회사 Stack boat tool
KR200493822Y1 (en) * 2019-09-06 2021-06-09 김진우 A bakery tray

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912980A (en) * 1988-12-05 1990-04-03 Team Corporation Modular test fixture for vibration and shock testing
US5103976A (en) * 1990-09-25 1992-04-14 R. H. Murphy Company, Inc. Tray for integrated circuits with supporting ribs
US5335771A (en) * 1990-09-25 1994-08-09 R. H. Murphy Company, Inc. Spacer trays for stacking storage trays with integrated circuits
US5400904C1 (en) * 1993-10-15 2001-01-16 Murphy R H Co Inc Tray for ball terminal integrated circuits
US5794783A (en) * 1996-12-31 1998-08-18 Intel Corporation Die-level burn-in and test flipping tray
US5957293A (en) * 1998-05-04 1999-09-28 Advanced Micro Devices, Inc. Tray to ship ceramic substrates and ceramic BGA packages
US6474475B1 (en) * 2000-02-22 2002-11-05 Micron Technology, Inc. Apparatus for handling stacked integrated circuit devices
US20050133404A1 (en) * 2003-12-23 2005-06-23 Peak Plastic & Metal Products (International) Limited Universal matrix tray for electronic devices

Also Published As

Publication number Publication date
WO2007108880A3 (en) 2008-11-20
US20070215517A1 (en) 2007-09-20
WO2007108880A2 (en) 2007-09-27

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