TW200739780A - Process condition sensing wafer and data analysis system - Google Patents

Process condition sensing wafer and data analysis system

Info

Publication number
TW200739780A
TW200739780A TW095146033A TW95146033A TW200739780A TW 200739780 A TW200739780 A TW 200739780A TW 095146033 A TW095146033 A TW 095146033A TW 95146033 A TW95146033 A TW 95146033A TW 200739780 A TW200739780 A TW 200739780A
Authority
TW
Taiwan
Prior art keywords
conditions
data analysis
analysis system
process condition
sensing wafer
Prior art date
Application number
TW095146033A
Other languages
Chinese (zh)
Other versions
TWI405281B (en
Inventor
Wayne G Renken
Mei H Sun
Original Assignee
Sensarray Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/302,763 external-priority patent/US7757574B2/en
Application filed by Sensarray Corp filed Critical Sensarray Corp
Publication of TW200739780A publication Critical patent/TW200739780A/en
Application granted granted Critical
Publication of TWI405281B publication Critical patent/TWI405281B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device. Isolation may be provided by vacuum or suitable material and phase change material may be located adjacent to electronics to maintain a low temperature.
TW095146033A 2005-12-13 2006-12-08 Process condition sensing wafer and data analysis system TWI405281B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/302,763 US7757574B2 (en) 2002-01-24 2005-12-13 Process condition sensing wafer and data analysis system

Publications (2)

Publication Number Publication Date
TW200739780A true TW200739780A (en) 2007-10-16
TWI405281B TWI405281B (en) 2013-08-11

Family

ID=38363125

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095146033A TWI405281B (en) 2005-12-13 2006-12-08 Process condition sensing wafer and data analysis system

Country Status (3)

Country Link
JP (1) JP5043426B2 (en)
KR (1) KR101337508B1 (en)
TW (1) TWI405281B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102834950A (en) * 2009-12-18 2012-12-19 克拉-坦科股份有限公司 Component package for maintaining safe operating temperature of components
CN103620735A (en) * 2011-05-10 2014-03-05 科磊股份有限公司 Heat shield module for substrate-like metrology device
TWI478209B (en) * 2010-05-31 2015-03-21 Tokyo Electron Ltd A substrate processing apparatus, and a substrate processing system
US9165846B2 (en) 2002-01-24 2015-10-20 Kla-Tencor Corporation Process condition sensing wafer and data analysis system
CN109314066A (en) * 2016-06-15 2019-02-05 科磊股份有限公司 For obtaining the encapsulation instrumentation substrate of the measurement parameter in high-temperature technology application

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101985989B1 (en) * 2012-05-16 2019-06-04 헨켈 아이피 앤드 홀딩 게엠베하 Thermally insulative composition and electronic devices assembled therewith
US9222842B2 (en) * 2013-01-07 2015-12-29 Kla-Tencor Corporation High temperature sensor wafer for in-situ measurements in active plasma
JP2013232663A (en) * 2013-06-20 2013-11-14 Nikon Corp Substrate holder apparatus and substrate bonding apparatus
TWI657132B (en) 2013-12-19 2019-04-21 德商漢高智慧財產控股公司 Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
KR102404310B1 (en) * 2015-10-08 2022-06-02 주식회사 케이씨텍 Chemical mechanical polishing apparatus
US11150140B2 (en) * 2016-02-02 2021-10-19 Kla Corporation Instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
KR101984868B1 (en) * 2017-06-20 2019-06-11 (주)이노페이스 process diagnosis sensor for high temperature
CN113432737A (en) * 2020-03-19 2021-09-24 长鑫存储技术有限公司 Method for measuring and calibrating temperature of wafer chuck and temperature measuring system

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US4795975A (en) * 1986-09-26 1989-01-03 Texas Instruments Incorporated Thermal and electromagnetic shield for power meter
JP3250285B2 (en) * 1992-11-26 2002-01-28 セイコーエプソン株式会社 Substrate to be processed provided with information measuring means
US5444637A (en) * 1993-09-28 1995-08-22 Advanced Micro Devices, Inc. Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed
DE19707503B4 (en) * 1997-02-25 2007-01-04 Infineon Technologies Ag Pressure sensor component and method of manufacture
US6744346B1 (en) * 1998-02-27 2004-06-01 Micron Technology, Inc. Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece
US6181727B1 (en) * 1999-04-19 2001-01-30 General Electric Company Coating for reducing operating temperatures of chamber components of a coating apparatus
JP3853601B2 (en) * 2001-03-12 2006-12-06 株式会社東芝 Semiconductor modules and coolers
WO2003053769A1 (en) * 2001-12-20 2003-07-03 Arctic Cat Inc. Tandem four-wheel vehicle
US6889568B2 (en) * 2002-01-24 2005-05-10 Sensarray Corporation Process condition sensing wafer and data analysis system
JP2005156314A (en) * 2003-11-25 2005-06-16 Nippon Chemicon Corp Method and device for measuring temperature of semiconductor wafer

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9165846B2 (en) 2002-01-24 2015-10-20 Kla-Tencor Corporation Process condition sensing wafer and data analysis system
CN102834950A (en) * 2009-12-18 2012-12-19 克拉-坦科股份有限公司 Component package for maintaining safe operating temperature of components
CN102834950B (en) * 2009-12-18 2015-10-14 克拉-坦科股份有限公司 For maintaining the component package of the safe operating temperature of assembly
TWI478209B (en) * 2010-05-31 2015-03-21 Tokyo Electron Ltd A substrate processing apparatus, and a substrate processing system
CN103620735A (en) * 2011-05-10 2014-03-05 科磊股份有限公司 Heat shield module for substrate-like metrology device
CN109314066A (en) * 2016-06-15 2019-02-05 科磊股份有限公司 For obtaining the encapsulation instrumentation substrate of the measurement parameter in high-temperature technology application
CN109314066B (en) * 2016-06-15 2021-01-15 科磊股份有限公司 Packaged instrumented substrate apparatus for obtaining measurement parameters in high temperature process applications
US11823925B2 (en) 2016-06-15 2023-11-21 Kla Corporation Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications

Also Published As

Publication number Publication date
JP5043426B2 (en) 2012-10-10
JP2007208249A (en) 2007-08-16
TWI405281B (en) 2013-08-11
KR20070062936A (en) 2007-06-18
KR101337508B1 (en) 2013-12-06

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