TW200739257A - Photosensitive resin composition, and photosensitive element, resist pattern forming method and method for manufacturing printed wiring board using the same - Google Patents
Photosensitive resin composition, and photosensitive element, resist pattern forming method and method for manufacturing printed wiring board using the sameInfo
- Publication number
- TW200739257A TW200739257A TW095111997A TW95111997A TW200739257A TW 200739257 A TW200739257 A TW 200739257A TW 095111997 A TW095111997 A TW 095111997A TW 95111997 A TW95111997 A TW 95111997A TW 200739257 A TW200739257 A TW 200739257A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- resin composition
- resist pattern
- photosensitive resin
- wiring board
- Prior art date
Links
Landscapes
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
Abstract
To provide a photosensitive resin composition capable of performing formation of a resist pattern by a direct drawing exposure method with sufficient sensitivity and resolution, and to provide a photosensitive element, a resist pattern forming method and a method for manufacturing a printed wiring board using the composition. The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond and (C1) a coumarin derivative containing a tertiary amino group represented by formula (1) wherein R1 and R2 each independently denote an alkyl group; R3 - R7 each independently denote an alkyl group which may have a substituent, H, a trifluoromethyl group, a carboxyl group, a carboxylic ester group, a hydroxyl group or a thiol group; and R1 - R7 may bond to each other to form a cyclic structure.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004291783A JP4599974B2 (en) | 2004-10-04 | 2004-10-04 | Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200739257A true TW200739257A (en) | 2007-10-16 |
Family
ID=36376113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095111997A TW200739257A (en) | 2004-10-04 | 2006-04-04 | Photosensitive resin composition, and photosensitive element, resist pattern forming method and method for manufacturing printed wiring board using the same |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4599974B2 (en) |
TW (1) | TW200739257A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4942969B2 (en) * | 2005-09-16 | 2012-05-30 | 富士フイルム株式会社 | Pattern forming material and pattern forming method |
WO2007135894A1 (en) * | 2006-05-24 | 2007-11-29 | Konica Minolta Medical & Graphic, Inc. | Photosensitive composition, sheet for photosensitive resist, method for forming resist pattern, and method for manufacturing printed wiring board |
US7838197B2 (en) * | 2006-11-15 | 2010-11-23 | Taiyo Ink Mfg. Co., Ltd. | Photosensitive composition |
KR100963354B1 (en) * | 2006-11-15 | 2010-06-14 | 다이요 잉키 세이조 가부시키가이샤 | Photosensitive composition |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05119478A (en) * | 1991-10-29 | 1993-05-18 | Asahi Chem Ind Co Ltd | Production of polyimide pattern |
EP0624826B1 (en) * | 1993-05-14 | 1997-07-16 | OCG Microelectronic Materials Inc. | Method of forming relief patterns by i-line light irradiation |
JP2000344812A (en) * | 1999-06-07 | 2000-12-12 | Toyo Ink Mfg Co Ltd | Polymerizable composition |
JP4051594B2 (en) * | 2000-03-09 | 2008-02-27 | 日立化成工業株式会社 | Photosensitive resin composition, photosensitive element using the same, resist pattern manufacturing method, and printed wiring board manufacturing method |
JP2002363206A (en) * | 2001-06-07 | 2002-12-18 | Fuji Photo Film Co Ltd | Photopolymerizable composition and recording material using the same |
JP3997462B2 (en) * | 2001-11-12 | 2007-10-24 | 株式会社カネカ | Photosensitive resin composition, photosensitive dry film resist using the same, photosensitive coverlay film for flexible printed wiring board, and photosensitive coverlay film for head of hard disk device of personal computer |
JP3855998B2 (en) * | 2002-02-28 | 2006-12-13 | 日立化成工業株式会社 | Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method |
JP2003262956A (en) * | 2002-03-12 | 2003-09-19 | Hitachi Chem Co Ltd | Photosensitive resin composition, photosensitive element using the same, method for manufacturing resist pattern and method for manufacturing printed wiring board |
-
2004
- 2004-10-04 JP JP2004291783A patent/JP4599974B2/en not_active Expired - Fee Related
-
2006
- 2006-04-04 TW TW095111997A patent/TW200739257A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2006106283A (en) | 2006-04-20 |
JP4599974B2 (en) | 2010-12-15 |
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