TW200739257A - Photosensitive resin composition, and photosensitive element, resist pattern forming method and method for manufacturing printed wiring board using the same - Google Patents

Photosensitive resin composition, and photosensitive element, resist pattern forming method and method for manufacturing printed wiring board using the same

Info

Publication number
TW200739257A
TW200739257A TW095111997A TW95111997A TW200739257A TW 200739257 A TW200739257 A TW 200739257A TW 095111997 A TW095111997 A TW 095111997A TW 95111997 A TW95111997 A TW 95111997A TW 200739257 A TW200739257 A TW 200739257A
Authority
TW
Taiwan
Prior art keywords
group
resin composition
resist pattern
photosensitive resin
wiring board
Prior art date
Application number
TW095111997A
Other languages
Chinese (zh)
Inventor
Takashi Kumaki
Masahiro Miyasaka
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200739257A publication Critical patent/TW200739257A/en

Links

Landscapes

  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

To provide a photosensitive resin composition capable of performing formation of a resist pattern by a direct drawing exposure method with sufficient sensitivity and resolution, and to provide a photosensitive element, a resist pattern forming method and a method for manufacturing a printed wiring board using the composition. The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond and (C1) a coumarin derivative containing a tertiary amino group represented by formula (1) wherein R1 and R2 each independently denote an alkyl group; R3 - R7 each independently denote an alkyl group which may have a substituent, H, a trifluoromethyl group, a carboxyl group, a carboxylic ester group, a hydroxyl group or a thiol group; and R1 - R7 may bond to each other to form a cyclic structure.
TW095111997A 2004-10-04 2006-04-04 Photosensitive resin composition, and photosensitive element, resist pattern forming method and method for manufacturing printed wiring board using the same TW200739257A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004291783A JP4599974B2 (en) 2004-10-04 2004-10-04 Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method

Publications (1)

Publication Number Publication Date
TW200739257A true TW200739257A (en) 2007-10-16

Family

ID=36376113

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095111997A TW200739257A (en) 2004-10-04 2006-04-04 Photosensitive resin composition, and photosensitive element, resist pattern forming method and method for manufacturing printed wiring board using the same

Country Status (2)

Country Link
JP (1) JP4599974B2 (en)
TW (1) TW200739257A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4942969B2 (en) * 2005-09-16 2012-05-30 富士フイルム株式会社 Pattern forming material and pattern forming method
WO2007135894A1 (en) * 2006-05-24 2007-11-29 Konica Minolta Medical & Graphic, Inc. Photosensitive composition, sheet for photosensitive resist, method for forming resist pattern, and method for manufacturing printed wiring board
US7838197B2 (en) * 2006-11-15 2010-11-23 Taiyo Ink Mfg. Co., Ltd. Photosensitive composition
KR100963354B1 (en) * 2006-11-15 2010-06-14 다이요 잉키 세이조 가부시키가이샤 Photosensitive composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05119478A (en) * 1991-10-29 1993-05-18 Asahi Chem Ind Co Ltd Production of polyimide pattern
EP0624826B1 (en) * 1993-05-14 1997-07-16 OCG Microelectronic Materials Inc. Method of forming relief patterns by i-line light irradiation
JP2000344812A (en) * 1999-06-07 2000-12-12 Toyo Ink Mfg Co Ltd Polymerizable composition
JP4051594B2 (en) * 2000-03-09 2008-02-27 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern manufacturing method, and printed wiring board manufacturing method
JP2002363206A (en) * 2001-06-07 2002-12-18 Fuji Photo Film Co Ltd Photopolymerizable composition and recording material using the same
JP3997462B2 (en) * 2001-11-12 2007-10-24 株式会社カネカ Photosensitive resin composition, photosensitive dry film resist using the same, photosensitive coverlay film for flexible printed wiring board, and photosensitive coverlay film for head of hard disk device of personal computer
JP3855998B2 (en) * 2002-02-28 2006-12-13 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method
JP2003262956A (en) * 2002-03-12 2003-09-19 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element using the same, method for manufacturing resist pattern and method for manufacturing printed wiring board

Also Published As

Publication number Publication date
JP2006106283A (en) 2006-04-20
JP4599974B2 (en) 2010-12-15

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