TW200732504A - Adjustable electrode assembly for use in processing substrates of differing widths in a plasma processing system - Google Patents

Adjustable electrode assembly for use in processing substrates of differing widths in a plasma processing system

Info

Publication number
TW200732504A
TW200732504A TW095132424A TW95132424A TW200732504A TW 200732504 A TW200732504 A TW 200732504A TW 095132424 A TW095132424 A TW 095132424A TW 95132424 A TW95132424 A TW 95132424A TW 200732504 A TW200732504 A TW 200732504A
Authority
TW
Taiwan
Prior art keywords
electrode
electrode assembly
processing system
substrates
plasma processing
Prior art date
Application number
TW095132424A
Other languages
English (en)
Other versions
TWI381065B (zh
Inventor
Thomas V Ii Bolden
Original Assignee
Nordson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordson Corp filed Critical Nordson Corp
Publication of TW200732504A publication Critical patent/TW200732504A/zh
Application granted granted Critical
Publication of TWI381065B publication Critical patent/TWI381065B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32605—Removable or replaceable electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S269/00—Work holders
    • Y10S269/905—Work holder for doors and door frames
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Treatment Of Fiber Materials (AREA)
TW095132424A 2005-09-28 2006-09-01 電漿處理系統中用於處理不同寬度基板之可調式電極組件 TWI381065B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/239,570 US7455735B2 (en) 2005-09-28 2005-09-28 Width adjustable substrate support for plasma processing

Publications (2)

Publication Number Publication Date
TW200732504A true TW200732504A (en) 2007-09-01
TWI381065B TWI381065B (zh) 2013-01-01

Family

ID=37832784

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132424A TWI381065B (zh) 2005-09-28 2006-09-01 電漿處理系統中用於處理不同寬度基板之可調式電極組件

Country Status (6)

Country Link
US (1) US7455735B2 (zh)
JP (1) JP5420144B2 (zh)
CN (1) CN1956138B (zh)
DE (1) DE102006040593A1 (zh)
SG (1) SG131038A1 (zh)
TW (1) TWI381065B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7465680B2 (en) * 2005-09-07 2008-12-16 Applied Materials, Inc. Post deposition plasma treatment to increase tensile stress of HDP-CVD SIO2
US8171877B2 (en) * 2007-03-14 2012-05-08 Lam Research Corporation Backside mounted electrode carriers and assemblies incorporating the same
JP4850811B2 (ja) * 2007-11-06 2012-01-11 東京エレクトロン株式会社 載置台、処理装置および処理システム
JP4805286B2 (ja) * 2008-02-06 2011-11-02 シャープ株式会社 搬送装置
US8276604B2 (en) * 2008-06-30 2012-10-02 Lam Research Corporation Peripherally engaging electrode carriers and assemblies incorporating the same
CN102398234A (zh) * 2010-09-07 2012-04-04 安特(苏州)精密机械有限公司 一种弹簧片配送夹具
DE102014211713A1 (de) * 2014-06-18 2015-12-24 Siemens Aktiengesellschaft Vorrichtung zur Plasmabeschichtung und Verfahren zum Beschichten einer Platine
CN104409401B (zh) * 2014-12-26 2017-02-22 合肥彩虹蓝光科技有限公司 一种等离子清洗设备
JP6645921B2 (ja) * 2016-07-07 2020-02-14 キオクシア株式会社 プラズマ処理装置およびプラズマ処理方法
US20180308661A1 (en) * 2017-04-24 2018-10-25 Applied Materials, Inc. Plasma reactor with electrode filaments
US10510515B2 (en) 2017-06-22 2019-12-17 Applied Materials, Inc. Processing tool with electrically switched electrode assembly
DE102019201166A1 (de) * 2019-01-30 2020-07-30 Siemens Aktiengesellschaft Werkstückträger zum Halten eines zu beschichtenden Bauteils, Verwendung eines solchen Werkstückträgers sowie Vorrichtung und Verfahren zum Beschichten eines Bauteils

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3133307B2 (ja) * 1989-10-13 2001-02-05 株式会社日立製作所 電子顕微鏡
US5075530A (en) * 1990-07-23 1991-12-24 Lee Shih Lu Multi-head type of electro-discharging machine
EP0572716B1 (fr) 1992-05-30 1996-10-09 Charmilles Technologies S.A. Machine d'électroérosion à fil avec pièce à usiner fixe
US5895549A (en) * 1994-07-11 1999-04-20 Applied Komatsu Technology, Inc. Method and apparatus for etching film layers on large substrates
US6245189B1 (en) * 1994-12-05 2001-06-12 Nordson Corporation High Throughput plasma treatment system
JP4937474B2 (ja) * 1999-07-13 2012-05-23 ノードソン コーポレーション 高速対称プラズマ処理システム
US6709522B1 (en) * 2000-07-11 2004-03-23 Nordson Corporation Material handling system and methods for a multichamber plasma treatment system
US6451120B1 (en) * 2000-09-21 2002-09-17 Adc Telecommunications, Inc. Apparatus and method for batch processing semiconductor substrates in making semiconductor lasers
JP2001326266A (ja) * 2001-02-20 2001-11-22 Matsushita Electric Ind Co Ltd プラズマクリーニング装置
US6841033B2 (en) * 2001-03-21 2005-01-11 Nordson Corporation Material handling system and method for a multi-workpiece plasma treatment system
US6852169B2 (en) * 2001-05-16 2005-02-08 Nordson Corporation Apparatus and methods for processing optical fibers with a plasma
US7013834B2 (en) * 2002-04-19 2006-03-21 Nordson Corporation Plasma treatment system
US7018555B2 (en) * 2002-07-26 2006-03-28 Dainippon Screen Mfg. Co., Ltd. Substrate treatment method and substrate treatment apparatus
JP4413084B2 (ja) * 2003-07-30 2010-02-10 シャープ株式会社 プラズマプロセス装置及びそのクリーニング方法
JP4281692B2 (ja) * 2005-02-15 2009-06-17 パナソニック株式会社 プラズマ処理装置

Also Published As

Publication number Publication date
TWI381065B (zh) 2013-01-01
JP5420144B2 (ja) 2014-02-19
US7455735B2 (en) 2008-11-25
US20070068455A1 (en) 2007-03-29
JP2007095695A (ja) 2007-04-12
CN1956138A (zh) 2007-05-02
DE102006040593A1 (de) 2007-03-29
SG131038A1 (en) 2007-04-26
CN1956138B (zh) 2010-06-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees