TW200732449A - Adhesive film - Google Patents
Adhesive filmInfo
- Publication number
- TW200732449A TW200732449A TW095106560A TW95106560A TW200732449A TW 200732449 A TW200732449 A TW 200732449A TW 095106560 A TW095106560 A TW 095106560A TW 95106560 A TW95106560 A TW 95106560A TW 200732449 A TW200732449 A TW 200732449A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive film
- resin
- filler
- curable
- curable resin
- Prior art date
Links
Abstract
The present invention relates to an adhesive film used for bonding a member for semiconductor or liquid crystal display to a substrate. The adhesive film is composed of a resin composition comprising a curable resin and a filler, and has a moisture permeability of 30 [g/m<SP>2</SP>*24h] or above. The curable resin is preferably a photocurable resin, a thermosetting resin, or a curable resin that is curable under either light or heat. The filler is a porous filler and has an average pore diameter of 0.1-5 nm. The moisture permeability of the adhesive film is preferably 4 [g/m<SP>2</SP>*24h] or above at 25 DEG C.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004251245A JP4694804B2 (en) | 2004-08-31 | 2004-08-31 | Adhesive film and hollow package |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200732449A true TW200732449A (en) | 2007-09-01 |
Family
ID=36151020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095106560A TW200732449A (en) | 2004-08-31 | 2006-02-27 | Adhesive film |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4694804B2 (en) |
TW (1) | TW200732449A (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101090562B1 (en) | 2006-02-27 | 2011-12-08 | 스미토모 베이클리트 컴퍼니 리미티드 | Adhesive film |
JP5344802B2 (en) * | 2007-03-30 | 2013-11-20 | リンテック株式会社 | Protective film forming sheet for chip and semiconductor chip with protective film |
JP5233164B2 (en) * | 2007-05-21 | 2013-07-10 | 住友ベークライト株式会社 | Resin composition, adhesive film and light receiving device |
WO2008155895A1 (en) | 2007-06-19 | 2008-12-24 | Sumitomo Bakelite Co., Ltd. | Electronic device manufacturing method |
JP2009043893A (en) * | 2007-08-08 | 2009-02-26 | Fujikura Ltd | Semiconductor package and manufacturing method thereof |
JP5620834B2 (en) * | 2011-01-26 | 2014-11-05 | リンテック株式会社 | Adhesive composition and adhesive sheet |
JP5743638B2 (en) * | 2011-03-28 | 2015-07-01 | リンテック株式会社 | Protective film forming film and chip protective film forming sheet |
-
2004
- 2004-08-31 JP JP2004251245A patent/JP4694804B2/en not_active Expired - Fee Related
-
2006
- 2006-02-27 TW TW095106560A patent/TW200732449A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2006070053A (en) | 2006-03-16 |
JP4694804B2 (en) | 2011-06-08 |
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