TW200732449A - Adhesive film - Google Patents

Adhesive film

Info

Publication number
TW200732449A
TW200732449A TW095106560A TW95106560A TW200732449A TW 200732449 A TW200732449 A TW 200732449A TW 095106560 A TW095106560 A TW 095106560A TW 95106560 A TW95106560 A TW 95106560A TW 200732449 A TW200732449 A TW 200732449A
Authority
TW
Taiwan
Prior art keywords
adhesive film
resin
filler
curable
curable resin
Prior art date
Application number
TW095106560A
Other languages
Chinese (zh)
Inventor
Toyosei Takahashi
Original Assignee
Sumitomo Bakelite Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co filed Critical Sumitomo Bakelite Co
Publication of TW200732449A publication Critical patent/TW200732449A/en

Links

Abstract

The present invention relates to an adhesive film used for bonding a member for semiconductor or liquid crystal display to a substrate. The adhesive film is composed of a resin composition comprising a curable resin and a filler, and has a moisture permeability of 30 [g/m<SP>2</SP>*24h] or above. The curable resin is preferably a photocurable resin, a thermosetting resin, or a curable resin that is curable under either light or heat. The filler is a porous filler and has an average pore diameter of 0.1-5 nm. The moisture permeability of the adhesive film is preferably 4 [g/m<SP>2</SP>*24h] or above at 25 DEG C.
TW095106560A 2004-08-31 2006-02-27 Adhesive film TW200732449A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004251245A JP4694804B2 (en) 2004-08-31 2004-08-31 Adhesive film and hollow package

Publications (1)

Publication Number Publication Date
TW200732449A true TW200732449A (en) 2007-09-01

Family

ID=36151020

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106560A TW200732449A (en) 2004-08-31 2006-02-27 Adhesive film

Country Status (2)

Country Link
JP (1) JP4694804B2 (en)
TW (1) TW200732449A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101090562B1 (en) 2006-02-27 2011-12-08 스미토모 베이클리트 컴퍼니 리미티드 Adhesive film
JP5344802B2 (en) * 2007-03-30 2013-11-20 リンテック株式会社 Protective film forming sheet for chip and semiconductor chip with protective film
JP5233164B2 (en) * 2007-05-21 2013-07-10 住友ベークライト株式会社 Resin composition, adhesive film and light receiving device
WO2008155895A1 (en) 2007-06-19 2008-12-24 Sumitomo Bakelite Co., Ltd. Electronic device manufacturing method
JP2009043893A (en) * 2007-08-08 2009-02-26 Fujikura Ltd Semiconductor package and manufacturing method thereof
JP5620834B2 (en) * 2011-01-26 2014-11-05 リンテック株式会社 Adhesive composition and adhesive sheet
JP5743638B2 (en) * 2011-03-28 2015-07-01 リンテック株式会社 Protective film forming film and chip protective film forming sheet

Also Published As

Publication number Publication date
JP2006070053A (en) 2006-03-16
JP4694804B2 (en) 2011-06-08

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