TW200732246A - Chip for manufacturing micro-electromechanical system and micro-electromechanical chip device manufactured from the chip - Google Patents

Chip for manufacturing micro-electromechanical system and micro-electromechanical chip device manufactured from the chip

Info

Publication number
TW200732246A
TW200732246A TW095106106A TW95106106A TW200732246A TW 200732246 A TW200732246 A TW 200732246A TW 095106106 A TW095106106 A TW 095106106A TW 95106106 A TW95106106 A TW 95106106A TW 200732246 A TW200732246 A TW 200732246A
Authority
TW
Taiwan
Prior art keywords
chip
micro
electromechanical system
electromechanical
manufacturing
Prior art date
Application number
TW095106106A
Other languages
Chinese (zh)
Other versions
TWI295664B (en
Inventor
Ching-Liang Dai
Mao-Chen Liu
Original Assignee
Univ Nat Chunghsing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Chunghsing filed Critical Univ Nat Chunghsing
Priority to TW095106106A priority Critical patent/TW200732246A/en
Publication of TW200732246A publication Critical patent/TW200732246A/en
Application granted granted Critical
Publication of TWI295664B publication Critical patent/TWI295664B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)

Abstract

The invention is used for manufacturing a micro-electromechanical system and a chip which is manufactured by a CMOS process comprising a base material which is decided to set the micro-electromechanical system on the top surface of it, an integrated circuit which is formed from the top surface of the base surface downward, and a plurality of weld pad units which are deposited on the base material in interval. Each of the weld pad units has an electrical connecting port corresponding and connecting electrically to the integrated circuit, and two independent weld pads which are interlocked and piled up from the electrical connecting port using a plurality of metal layers respectively. One of the weld pads has a protecting layer which is formed on the piled metal layers. The protecting layer can protect the weld pad from being destroyed by etching when manufacturing the micro-electromechanical system. After the micro-electromechanical system is deposited on the chip, the weld pad units can be still electrically connected to outside by a welding wire, and it is ensured that the electrical signal can be input/output successfully.
TW095106106A 2006-02-23 2006-02-23 Chip for manufacturing micro-electromechanical system and micro-electromechanical chip device manufactured from the chip TW200732246A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095106106A TW200732246A (en) 2006-02-23 2006-02-23 Chip for manufacturing micro-electromechanical system and micro-electromechanical chip device manufactured from the chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095106106A TW200732246A (en) 2006-02-23 2006-02-23 Chip for manufacturing micro-electromechanical system and micro-electromechanical chip device manufactured from the chip

Publications (2)

Publication Number Publication Date
TW200732246A true TW200732246A (en) 2007-09-01
TWI295664B TWI295664B (en) 2008-04-11

Family

ID=45068509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106106A TW200732246A (en) 2006-02-23 2006-02-23 Chip for manufacturing micro-electromechanical system and micro-electromechanical chip device manufactured from the chip

Country Status (1)

Country Link
TW (1) TW200732246A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8872287B2 (en) 2008-03-27 2014-10-28 United Microelectronics Corp. Integrated structure for MEMS device and semiconductor device and method of fabricating the same
TWI586605B (en) * 2009-10-29 2017-06-11 愛德萬測試美國股份有限公司 Process for fabricating a multi-layer micro-electro-mechanical system and intermediary, multi-layered, metal complex to be used therein
TWI691454B (en) * 2017-10-25 2020-04-21 新加坡商世界先進積體電路私人有限公司 Monolithic integration of mems and ic devices and method of forming the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8716852B2 (en) * 2012-02-17 2014-05-06 Taiwan Semiconductor Manufacturing Company, Ltd. Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8872287B2 (en) 2008-03-27 2014-10-28 United Microelectronics Corp. Integrated structure for MEMS device and semiconductor device and method of fabricating the same
US9988264B2 (en) 2008-03-27 2018-06-05 United Microelectronics Corp. Method of fabricating integrated structure for MEMS device and semiconductor device
TWI586605B (en) * 2009-10-29 2017-06-11 愛德萬測試美國股份有限公司 Process for fabricating a multi-layer micro-electro-mechanical system and intermediary, multi-layered, metal complex to be used therein
TWI691454B (en) * 2017-10-25 2020-04-21 新加坡商世界先進積體電路私人有限公司 Monolithic integration of mems and ic devices and method of forming the same

Also Published As

Publication number Publication date
TWI295664B (en) 2008-04-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees