TW200731917A - Heat-sink with slant fins - Google Patents
Heat-sink with slant finsInfo
- Publication number
- TW200731917A TW200731917A TW095104922A TW95104922A TW200731917A TW 200731917 A TW200731917 A TW 200731917A TW 095104922 A TW095104922 A TW 095104922A TW 95104922 A TW95104922 A TW 95104922A TW 200731917 A TW200731917 A TW 200731917A
- Authority
- TW
- Taiwan
- Prior art keywords
- slant
- fins
- sink
- heat
- area
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095104922A TWI308050B (en) | 2006-02-14 | 2006-02-14 | Heat-sink with slant fins |
US11/656,522 US20070187070A1 (en) | 2006-02-14 | 2007-01-23 | Heat sink with slant fin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095104922A TWI308050B (en) | 2006-02-14 | 2006-02-14 | Heat-sink with slant fins |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200731917A true TW200731917A (en) | 2007-08-16 |
TWI308050B TWI308050B (en) | 2009-03-21 |
Family
ID=38367136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095104922A TWI308050B (en) | 2006-02-14 | 2006-02-14 | Heat-sink with slant fins |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070187070A1 (zh) |
TW (1) | TWI308050B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM336475U (en) * | 2008-03-03 | 2008-07-11 | Tai Sol Electronics Co Ltd | Heat dissipater with internal flow guiding function |
CN104471799B (zh) * | 2012-06-12 | 2017-10-17 | 安费诺富加宜(亚洲)私人有限公司 | 连接器组件 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2377321B (en) * | 2001-07-05 | 2003-06-11 | Enlight Corp | CPU cooling structure with a ventilation hood |
US20030168208A1 (en) * | 2002-03-11 | 2003-09-11 | Kaoru Sato | Electronic component cooling apparatus |
TW527099U (en) * | 2002-07-19 | 2003-04-01 | Hai-Ching Lin | Heat dissipation plate having gained heat dissipation efficiency |
TWM248226U (en) * | 2003-10-17 | 2004-10-21 | Hon Hai Prec Ind Co Ltd | Heat dissipating device |
US7019969B2 (en) * | 2004-06-30 | 2006-03-28 | International Business Machines Corporation | Dual fan heat sink with flow directors |
CN2770091Y (zh) * | 2004-12-24 | 2006-04-05 | 富准精密工业(深圳)有限公司 | 散热器 |
US20070227699A1 (en) * | 2006-03-31 | 2007-10-04 | Yoshifumi Nishi | Method, apparatus and system for flow distribution through a heat exchanger |
US20080017350A1 (en) * | 2006-07-21 | 2008-01-24 | Foxconn Technology Co., Ltd. | Heat sink |
US7568518B2 (en) * | 2006-07-21 | 2009-08-04 | Furui Precise Component (Kunshan) Co., Ltd. | Heat sink |
-
2006
- 2006-02-14 TW TW095104922A patent/TWI308050B/zh active
-
2007
- 2007-01-23 US US11/656,522 patent/US20070187070A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TWI308050B (en) | 2009-03-21 |
US20070187070A1 (en) | 2007-08-16 |
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