TW200731828A - Non-sawing process for manufacturing capacitive silicon-based microphone chip - Google Patents

Non-sawing process for manufacturing capacitive silicon-based microphone chip

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Publication number
TW200731828A
TW200731828A TW095104554A TW95104554A TW200731828A TW 200731828 A TW200731828 A TW 200731828A TW 095104554 A TW095104554 A TW 095104554A TW 95104554 A TW95104554 A TW 95104554A TW 200731828 A TW200731828 A TW 200731828A
Authority
TW
Taiwan
Prior art keywords
holes
etching
based microphone
sawing process
electrode films
Prior art date
Application number
TW095104554A
Other languages
Chinese (zh)
Other versions
TWI285509B (en
Inventor
rui-hua Hong
zhao-zhi Zhang
Zong-Ying Lin
Zun-Yi Cai
Original Assignee
Univ Nat Chunghsing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Chunghsing filed Critical Univ Nat Chunghsing
Priority to TW95104554A priority Critical patent/TWI285509B/en
Application granted granted Critical
Publication of TWI285509B publication Critical patent/TWI285509B/en
Publication of TW200731828A publication Critical patent/TW200731828A/en

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  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Pressure Sensors (AREA)

Abstract

The present invention provides a non-sawing process for manufacturing capacitive silicon-based microphone chip, which includes: first sequentially forming a plurality of first electrode films with multiple through holes, a plurality of sacrificial plates, a plurality of vibrating films and a plurality of second electrode films on a substrate; next forming a plurality of masking images at the bottom of the substrate corresponding to the plurality of first electrode films, each masking image having through holes corresponding to the plurality of through holes, and etching channels for circling the first electrode films; then removing the area of the substrate corresponding to the through holes by etching into the through holes of the masking images, and removing the area of the substrate corresponding to the etching channels by etching to the insides of the etching channels; and finally, removing each masking image to manufacture a plurality of separated capacitive silicon-based microphone chips.
TW95104554A 2006-02-10 2006-02-10 Sawing-free process for manufacturing wafer of capacitor-type silicon microphone TWI285509B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95104554A TWI285509B (en) 2006-02-10 2006-02-10 Sawing-free process for manufacturing wafer of capacitor-type silicon microphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95104554A TWI285509B (en) 2006-02-10 2006-02-10 Sawing-free process for manufacturing wafer of capacitor-type silicon microphone

Publications (2)

Publication Number Publication Date
TWI285509B TWI285509B (en) 2007-08-11
TW200731828A true TW200731828A (en) 2007-08-16

Family

ID=39456746

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95104554A TWI285509B (en) 2006-02-10 2006-02-10 Sawing-free process for manufacturing wafer of capacitor-type silicon microphone

Country Status (1)

Country Link
TW (1) TWI285509B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452006B (en) * 2009-11-13 2014-09-11 United Microelectronics Corp Mems structure and method for making the same
TWI473506B (en) * 2010-01-05 2015-02-11 Bosch Gmbh Robert Bauelement mit einer mikromechanischen mikrofonstruktur und verfahren zu dessen herstellung
TWI505723B (en) * 2009-12-29 2015-10-21 Bse Co Ltd Mems microphone and manufacturing method of the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI452006B (en) * 2009-11-13 2014-09-11 United Microelectronics Corp Mems structure and method for making the same
TWI505723B (en) * 2009-12-29 2015-10-21 Bse Co Ltd Mems microphone and manufacturing method of the same
TWI473506B (en) * 2010-01-05 2015-02-11 Bosch Gmbh Robert Bauelement mit einer mikromechanischen mikrofonstruktur und verfahren zu dessen herstellung

Also Published As

Publication number Publication date
TWI285509B (en) 2007-08-11

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MM4A Annulment or lapse of patent due to non-payment of fees