TW200731828A - Non-sawing process for manufacturing capacitive silicon-based microphone chip - Google Patents
Non-sawing process for manufacturing capacitive silicon-based microphone chipInfo
- Publication number
- TW200731828A TW200731828A TW095104554A TW95104554A TW200731828A TW 200731828 A TW200731828 A TW 200731828A TW 095104554 A TW095104554 A TW 095104554A TW 95104554 A TW95104554 A TW 95104554A TW 200731828 A TW200731828 A TW 200731828A
- Authority
- TW
- Taiwan
- Prior art keywords
- holes
- etching
- based microphone
- sawing process
- electrode films
- Prior art date
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
Abstract
The present invention provides a non-sawing process for manufacturing capacitive silicon-based microphone chip, which includes: first sequentially forming a plurality of first electrode films with multiple through holes, a plurality of sacrificial plates, a plurality of vibrating films and a plurality of second electrode films on a substrate; next forming a plurality of masking images at the bottom of the substrate corresponding to the plurality of first electrode films, each masking image having through holes corresponding to the plurality of through holes, and etching channels for circling the first electrode films; then removing the area of the substrate corresponding to the through holes by etching into the through holes of the masking images, and removing the area of the substrate corresponding to the etching channels by etching to the insides of the etching channels; and finally, removing each masking image to manufacture a plurality of separated capacitive silicon-based microphone chips.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95104554A TWI285509B (en) | 2006-02-10 | 2006-02-10 | Sawing-free process for manufacturing wafer of capacitor-type silicon microphone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95104554A TWI285509B (en) | 2006-02-10 | 2006-02-10 | Sawing-free process for manufacturing wafer of capacitor-type silicon microphone |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI285509B TWI285509B (en) | 2007-08-11 |
TW200731828A true TW200731828A (en) | 2007-08-16 |
Family
ID=39456746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95104554A TWI285509B (en) | 2006-02-10 | 2006-02-10 | Sawing-free process for manufacturing wafer of capacitor-type silicon microphone |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI285509B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI452006B (en) * | 2009-11-13 | 2014-09-11 | United Microelectronics Corp | Mems structure and method for making the same |
TWI473506B (en) * | 2010-01-05 | 2015-02-11 | Bosch Gmbh Robert | Bauelement mit einer mikromechanischen mikrofonstruktur und verfahren zu dessen herstellung |
TWI505723B (en) * | 2009-12-29 | 2015-10-21 | Bse Co Ltd | Mems microphone and manufacturing method of the same |
-
2006
- 2006-02-10 TW TW95104554A patent/TWI285509B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI452006B (en) * | 2009-11-13 | 2014-09-11 | United Microelectronics Corp | Mems structure and method for making the same |
TWI505723B (en) * | 2009-12-29 | 2015-10-21 | Bse Co Ltd | Mems microphone and manufacturing method of the same |
TWI473506B (en) * | 2010-01-05 | 2015-02-11 | Bosch Gmbh Robert | Bauelement mit einer mikromechanischen mikrofonstruktur und verfahren zu dessen herstellung |
Also Published As
Publication number | Publication date |
---|---|
TWI285509B (en) | 2007-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |