TW200731617A - Feeding power connector and electro-static chuck device - Google Patents

Feeding power connector and electro-static chuck device

Info

Publication number
TW200731617A
TW200731617A TW095132674A TW95132674A TW200731617A TW 200731617 A TW200731617 A TW 200731617A TW 095132674 A TW095132674 A TW 095132674A TW 95132674 A TW95132674 A TW 95132674A TW 200731617 A TW200731617 A TW 200731617A
Authority
TW
Taiwan
Prior art keywords
feeding power
power connector
conductor
vacuum state
connector
Prior art date
Application number
TW095132674A
Other languages
Chinese (zh)
Other versions
TWI305969B (en
Inventor
Ritsu Kawase
Yuuichi Hasegawa
Hiroshi Yagi
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Publication of TW200731617A publication Critical patent/TW200731617A/en
Application granted granted Critical
Publication of TWI305969B publication Critical patent/TWI305969B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

A feeding power connector and an electrostatic chuck device comprising the feeding power connector are provided. The feeding power connector enables a vacuum state to be maintained stably when the device is put in operation under vacuum for a long time, prevents passage of the air during the operation when a vacuum state and a non-vacuum state are repeated alternately, thereby preventing vacuum discharge at a joint portion of the feeding power connector and the main body of the device, and exhibits a uniform quality. A feeding power connector 100 is designed to be connected with a lead wire 30 comprising a conductor 31 and a coating layer 32 which covers the conductor 31 such that an end portion thereof is extended outward and uncovered, and comprises a connector body 10 on which an insertion hole 13 for the lead wire 30 to be inserted is formed, and a feeder pin 20 mounted on the connector body 10 and electrically connected with the conductor 31, wherein a resin filling portion 12 in which resin 60 is filled is formed at the edge of the coating layer 32 or in a part of the conductor 31 extended from the edge.
TW095132674A 2005-09-07 2006-09-05 Feeding power connector and electro-static chuck device TWI305969B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005259645A JP4508990B2 (en) 2005-09-07 2005-09-07 Power supply connector and electrostatic chuck device having the power supply connector

Publications (2)

Publication Number Publication Date
TW200731617A true TW200731617A (en) 2007-08-16
TWI305969B TWI305969B (en) 2009-02-01

Family

ID=37934648

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132674A TWI305969B (en) 2005-09-07 2006-09-05 Feeding power connector and electro-static chuck device

Country Status (4)

Country Link
JP (1) JP4508990B2 (en)
KR (1) KR100844204B1 (en)
CN (1) CN100440637C (en)
TW (1) TWI305969B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8264187B2 (en) * 2009-01-11 2012-09-11 Applied Materials, Inc. Systems, apparatus and methods for making an electrical connection
TWI395289B (en) * 2009-05-15 2013-05-01 Advanced Micro Fab Equip Inc An electrostatic chuck device, a plasma processing device, and a method of manufacturing an electrostatic chuck device
JP6358856B2 (en) 2014-05-29 2018-07-18 東京エレクトロン株式会社 Electrostatic adsorption device and cooling processing device
JP6464071B2 (en) * 2015-10-13 2019-02-06 日本特殊陶業株式会社 Substrate holding device
JP6742214B2 (en) * 2016-10-04 2020-08-19 株式会社ディスコ Power supply device for electrostatic chuck plate
JP6836663B2 (en) * 2017-11-24 2021-03-03 トーカロ株式会社 Heat generating member

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2703621B2 (en) * 1989-04-19 1998-01-26 アイシン・エィ・ダブリュ株式会社 Connector device
US5348497A (en) * 1992-08-14 1994-09-20 Applied Materials, Inc. High voltage vaccum feed-through electrical connector
JP3060359B2 (en) * 1994-04-06 2000-07-10 矢崎総業株式会社 Electrical connector
TW286414B (en) * 1995-07-10 1996-09-21 Watkins Johnson Co Electrostatic chuck assembly
US5929373A (en) * 1997-06-23 1999-07-27 Applied Materials, Inc. High voltage feed through
JP2001266999A (en) * 2000-03-17 2001-09-28 Fujikura Ltd Cable with connector
KR200221887Y1 (en) * 2000-10-31 2001-04-16 박상준 Connector structure which can adjust length of wire
JP3993408B2 (en) * 2001-10-05 2007-10-17 株式会社巴川製紙所 Electrostatic chuck device, assembly method thereof, and member for electrostatic chuck device
JP4021661B2 (en) * 2001-12-27 2007-12-12 株式会社巴川製紙所 Electrostatic chuck device

Also Published As

Publication number Publication date
JP4508990B2 (en) 2010-07-21
JP2007073363A (en) 2007-03-22
KR100844204B1 (en) 2008-07-04
CN1945905A (en) 2007-04-11
CN100440637C (en) 2008-12-03
TWI305969B (en) 2009-02-01
KR20070028238A (en) 2007-03-12

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