TW200730562A - Polyimido film and producing method thereof - Google Patents
Polyimido film and producing method thereofInfo
- Publication number
- TW200730562A TW200730562A TW095141659A TW95141659A TW200730562A TW 200730562 A TW200730562 A TW 200730562A TW 095141659 A TW095141659 A TW 095141659A TW 95141659 A TW95141659 A TW 95141659A TW 200730562 A TW200730562 A TW 200730562A
- Authority
- TW
- Taiwan
- Prior art keywords
- mol
- acid
- producing method
- polyimide film
- aromatic
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/16—Applications used for films
Abstract
A polyimide film is characterized in that is obtained by block copolymerizing an aromatic diamine component consisting of 10~25 mol% of para-phenylene diamine (a1) and 75~90 mol % of 4, 4' -diaminodiphenyl ether (a2) with an aromatic tetracarboxy acid consisting of 75~99.9 mol % of pyromellitic acid and 0.1~25 mol% of 3, 3', 4,4' -biphenyltetracarboxy acid; and the Young's modulus, linear expansion coefficient, water absorbency, and glass transition temperature of said polyimide film are controlled in a specific range.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005331005 | 2005-11-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200730562A true TW200730562A (en) | 2007-08-16 |
TWI418576B TWI418576B (en) | 2013-12-11 |
Family
ID=38275015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095141659A TWI418576B (en) | 2005-11-16 | 2006-11-10 | Polyimide film and producing method thereof |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101313883B1 (en) |
TW (1) | TWI418576B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111373004A (en) * | 2017-11-10 | 2020-07-03 | 韩国爱思开希可隆Pi股份有限公司 | Polyamide acid composition for covering conductor |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102347593B1 (en) * | 2019-11-21 | 2022-01-10 | 피아이첨단소재 주식회사 | Polyimide film and method for preparing the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5202412A (en) * | 1990-10-02 | 1993-04-13 | E. I. Du Pont De Nemours And Company | Polyimide copolymer precursors |
JP3687044B2 (en) * | 1995-12-29 | 2005-08-24 | 東レ・デュポン株式会社 | Copolymerized polyimide film and method for producing the same |
TW438861B (en) * | 1996-12-17 | 2001-06-07 | Toray Du Pont Kk | Copolymerized polyimide, copolymerized polyimide resin molded articles and the method of preparation thereof |
JP2002265643A (en) * | 2002-02-14 | 2002-09-18 | Du Pont Toray Co Ltd | Polyimide film for substrate of solar cell and solar cell substrate made thereof |
-
2006
- 2006-11-10 TW TW095141659A patent/TWI418576B/en not_active IP Right Cessation
- 2006-11-16 KR KR1020060113488A patent/KR101313883B1/en active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111373004A (en) * | 2017-11-10 | 2020-07-03 | 韩国爱思开希可隆Pi股份有限公司 | Polyamide acid composition for covering conductor |
CN111373004B (en) * | 2017-11-10 | 2022-04-01 | 韩国爱思开希可隆Pi股份有限公司 | Polyamide acid composition for covering conductor |
Also Published As
Publication number | Publication date |
---|---|
TWI418576B (en) | 2013-12-11 |
KR20070052230A (en) | 2007-05-21 |
KR101313883B1 (en) | 2013-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2311628A3 (en) | Manufacturing process for polyester film exhibiting low thermal shrinkage | |
WO2008060712A3 (en) | Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof | |
EP1659449A3 (en) | Low-temperature curable photosensitive compositions | |
WO2008060711A3 (en) | Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof | |
TW200609620A (en) | Optical film, light-diffusing film, and methods of making and using the same | |
BR0209028A (en) | Nuclear transfer method | |
WO2008118782A3 (en) | Fixation devices and method of repair | |
WO2003027178A3 (en) | Polyimide copolymer and methods for preparing the same | |
ATE538164T1 (en) | ANISOTROPIC POLYMER FOAM | |
WO2007142922A3 (en) | Tough cordierite glass-ceramics | |
MY169438A (en) | Resin composition, prepreg, laminate, and wiring board | |
WO2005094316A3 (en) | Low optical overlap mode (loom) waveguiding system and method of making same | |
FR2898014B1 (en) | METHOD FOR MANUFACTURING ICE DESSERT AND ICE DESSERT THUS OBTAINED | |
WO2007088547A3 (en) | Metabolic sink | |
WO2002010253A1 (en) | Polyamic acid, polyimide, process for producing these, and film of the polyimide | |
FR2936245B1 (en) | NOVEL O6-ALKYLGUANIN-DNA ALKYLTRANSFERASE SUBSTRATES AND MUTANTS THEREOF | |
WO2008063219A3 (en) | Devices, systems, and methods using magnetic force systems affecting the tongue or hyoid muscles in the upper airway | |
WO2008120398A1 (en) | Solvent-soluble 6,6-polyimide copolymer and process for producing the same | |
DK1444436T3 (en) | Wind energy system with power lines pre-installed in the tower | |
WO2006137915A3 (en) | Biologically inspired synthesis of thin films and materials | |
WO2003064496A3 (en) | Biodegradable polymer | |
WO2009069797A1 (en) | Method for producing polyamic acid solution and polyamic acid solution | |
BRPI0514451A (en) | foamed glass cooling device | |
TW200730562A (en) | Polyimido film and producing method thereof | |
WO2008055574A3 (en) | Musical string |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |