TW200730331A - Mold apparatus and mirror plate - Google Patents

Mold apparatus and mirror plate

Info

Publication number
TW200730331A
TW200730331A TW095143949A TW95143949A TW200730331A TW 200730331 A TW200730331 A TW 200730331A TW 095143949 A TW095143949 A TW 095143949A TW 95143949 A TW95143949 A TW 95143949A TW 200730331 A TW200730331 A TW 200730331A
Authority
TW
Taiwan
Prior art keywords
plate
plate member
mold apparatus
increased
surface facing
Prior art date
Application number
TW095143949A
Other languages
Chinese (zh)
Inventor
Hiroyuki Sawaishi
Kazuhiro Hattori
Ryohsuke Niwaki
Original Assignee
Sumitomo Heavy Industries
Seiko Giken Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries, Seiko Giken Kk filed Critical Sumitomo Heavy Industries
Publication of TW200730331A publication Critical patent/TW200730331A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2632—Stampers; Mountings thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/263—Preparing and using a stamper, e.g. pressing or injection molding substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms

Abstract

The present invention provides a mold apparatus and mirror plate that does not retain inner stress in a formed product and the quality of the formed product is increased. It includes a first plate member and a second plate member arranged to face the first plate member and made of the same material as the first plate member; multiple gap parts are formed on the surface facing the other surface of at least one plate of the first plate and the second plate. Since the multiple gap parts are formed on the surface facing the other surface of at least one plate of the first plate and the second plate, the local temperature unevenness generating in the molding material in a cavity space can be inhibited. Accordingly, the pattern of an insert can be well transferred, resulting in an improved quality of a molded article. The first plate member and the second plate member are made of the same material, so diffusion bonding can be easily carried out. Meanwhile, because the ratio of thermal expansion of the first plate member is the same as that of the second plate member, the durability of the mold apparatus is increased.
TW095143949A 2005-11-29 2006-11-28 Mold apparatus and mirror plate TW200730331A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005344372A JP2007144880A (en) 2005-11-29 2005-11-29 Mold apparatus and mirror surfacing machine

Publications (1)

Publication Number Publication Date
TW200730331A true TW200730331A (en) 2007-08-16

Family

ID=38092082

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095143949A TW200730331A (en) 2005-11-29 2006-11-28 Mold apparatus and mirror plate

Country Status (7)

Country Link
US (1) US20090041881A1 (en)
EP (1) EP1955834A1 (en)
JP (1) JP2007144880A (en)
KR (1) KR20080072880A (en)
CN (1) CN101316690A (en)
TW (1) TW200730331A (en)
WO (1) WO2007063747A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2922805B1 (en) 2007-10-26 2013-09-06 Aplix Sa INSERTION BLOCK FOR THE FORMATION OF A FIELD OF HOOKS ON AN INJECTION MOLDED OBJECT AND A MOLDED OBJECT HAVING A HOOK FIELD OF THIS TYPE

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1582704A (en) * 1923-09-08 1926-04-27 Scranton Button Company Die for phonograph records
GB1509362A (en) * 1977-01-17 1978-05-04 Emi Electrola Gmbh Disc record press
US4340353A (en) * 1980-10-31 1982-07-20 Discovision Associates Hot sprue valve assembly for an injection molding machine
JP3002418B2 (en) * 1996-03-22 2000-01-24 株式会社精工技研 Mold device for optical disk molding
JP3550461B2 (en) * 1996-06-14 2004-08-04 株式会社日立製作所 Plastic molding method and optical disk manufacturing method
JP2965908B2 (en) * 1996-07-05 1999-10-18 株式会社精工技研 Mold device for optical disk molding provided with temperature-controlled liquid sealing means
NL1005502C2 (en) * 1997-03-12 1998-09-15 Ict Axxicon Bv Die for manufacturing disc-shaped objects.
US6095786A (en) * 1997-05-30 2000-08-01 Matsushita Electric Industrial Co., Ltd. Substrate forming mold, and plate thickness adjusting method of formed substrate in substrate forming mold
JP3648364B2 (en) * 1997-10-20 2005-05-18 株式会社リコー Resin molding equipment
JPH11246229A (en) * 1998-03-06 1999-09-14 Asahi Optical Co Ltd Mold for molding optical element
US6290882B1 (en) * 1999-06-07 2001-09-18 Galic Maus Ventures Llp Reduced-knitline thermoplastic injection molding using multi-gated non-sequential-fill method and apparatus, with a heating phase and a cooling phase in each molding cycle
JP2001191369A (en) * 2000-01-13 2001-07-17 Ricoh Co Ltd Mold for thin-walled substrate and molded thin-walled substrate
CN1140396C (en) * 2000-08-04 2004-03-03 株式会社精工技研 Disc-moulding mould
JP3768169B2 (en) * 2001-05-01 2006-04-19 三菱エンジニアリングプラスチックス株式会社 Mold assembly and injection molding method
DE10221558B4 (en) * 2002-05-15 2005-07-21 Krauss-Maffei Kunststofftechnik Gmbh Mold part, mold and method for injection molding plastic articles
JP3825014B2 (en) * 2003-04-25 2006-09-20 沖電気工業株式会社 Semiconductor wafer resin sealing device and mold for manufacturing semiconductor device
WO2005095082A1 (en) * 2004-03-31 2005-10-13 Sumitomo Heavy Industries, Ltd. Disc molding die, mirror-surface plate and molded object

Also Published As

Publication number Publication date
KR20080072880A (en) 2008-08-07
US20090041881A1 (en) 2009-02-12
CN101316690A (en) 2008-12-03
EP1955834A1 (en) 2008-08-13
WO2007063747A1 (en) 2007-06-07
JP2007144880A (en) 2007-06-14

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