TW200730302A - Superhard cutters and associated methods - Google Patents

Superhard cutters and associated methods

Info

Publication number
TW200730302A
TW200730302A TW095115836A TW95115836A TW200730302A TW 200730302 A TW200730302 A TW 200730302A TW 095115836 A TW095115836 A TW 095115836A TW 95115836 A TW95115836 A TW 95115836A TW 200730302 A TW200730302 A TW 200730302A
Authority
TW
Taiwan
Prior art keywords
associated methods
cutting
superhard cutters
base
working side
Prior art date
Application number
TW095115836A
Other languages
English (en)
Other versions
TWI304761B (en
Inventor
jian-min Song
Original Assignee
jian-min Song
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by jian-min Song filed Critical jian-min Song
Publication of TW200730302A publication Critical patent/TW200730302A/zh
Application granted granted Critical
Publication of TWI304761B publication Critical patent/TWI304761B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
TW095115836A 2005-05-16 2006-05-04 Superhard cutters and associated methods TWI304761B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US68179805P 2005-05-16 2005-05-16
US11/357,713 US20060258276A1 (en) 2005-05-16 2006-02-17 Superhard cutters and associated methods

Publications (2)

Publication Number Publication Date
TW200730302A true TW200730302A (en) 2007-08-16
TWI304761B TWI304761B (en) 2009-01-01

Family

ID=37419762

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115836A TWI304761B (en) 2005-05-16 2006-05-04 Superhard cutters and associated methods

Country Status (6)

Country Link
US (1) US20060258276A1 (zh)
EP (1) EP1879719A2 (zh)
JP (1) JP2008540154A (zh)
KR (1) KR20080007343A (zh)
TW (1) TWI304761B (zh)
WO (1) WO2006124792A2 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406736B (zh) * 2005-08-25 2013-09-01 Hiroshi Ishizuka 具有燒結體研磨部位之工具及其製造方法
TWI512851B (zh) * 2012-09-01 2015-12-11 Alpha & Omega Semiconductor 帶有厚底部基座的晶圓級封裝器件及其製備方法

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US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8974270B2 (en) 2011-05-23 2015-03-10 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US20150017884A1 (en) * 2006-11-16 2015-01-15 Chien-Min Sung CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods
US20080153398A1 (en) * 2006-11-16 2008-06-26 Chien-Min Sung Cmp pad conditioners and associated methods
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TWI388402B (en) 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
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CN103221180A (zh) 2010-09-21 2013-07-24 铼钻科技股份有限公司 具有基本平坦颗粒尖端的超研磨工具及其相关方法
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CN103372809A (zh) * 2012-04-12 2013-10-30 江西赛维Ldk太阳能高科技有限公司 一种改善硅块磨面质量的方法
JP6188286B2 (ja) 2012-07-13 2017-08-30 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びガラス、セラミックス、及び金属材料の研磨方法
JP5976228B2 (ja) * 2013-08-26 2016-08-23 株式会社東京精密 ダイシングブレード
JP6337458B2 (ja) * 2013-12-16 2018-06-06 株式会社リコー 研磨シート、及び、研磨具
JP6199231B2 (ja) * 2014-04-15 2017-09-20 株式会社ノリタケカンパニーリミテド ラップ加工用砥石
CN112388522A (zh) * 2019-08-12 2021-02-23 南昌巨晶砂轮科技有限公司 一种磨削弧齿的磨具的制备方法
KR102570825B1 (ko) * 2020-07-16 2023-08-28 한국생산기술연구원 다공성 돌출 패턴을 포함하는 연마 패드 및 이를 포함하는 연마 장치
WO2022014978A1 (ko) * 2020-07-16 2022-01-20 한국생산기술연구원 연마 패드, 이를 포함하는 연마 장치, 그리고 연마 패드의 제조 방법

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406736B (zh) * 2005-08-25 2013-09-01 Hiroshi Ishizuka 具有燒結體研磨部位之工具及其製造方法
TWI512851B (zh) * 2012-09-01 2015-12-11 Alpha & Omega Semiconductor 帶有厚底部基座的晶圓級封裝器件及其製備方法

Also Published As

Publication number Publication date
US20060258276A1 (en) 2006-11-16
TWI304761B (en) 2009-01-01
WO2006124792A2 (en) 2006-11-23
JP2008540154A (ja) 2008-11-20
WO2006124792A3 (en) 2007-08-16
EP1879719A2 (en) 2008-01-23
KR20080007343A (ko) 2008-01-18

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