TW200729653A - Semiconductor device and method of manufacturing semiconductor device - Google Patents

Semiconductor device and method of manufacturing semiconductor device

Info

Publication number
TW200729653A
TW200729653A TW095139420A TW95139420A TW200729653A TW 200729653 A TW200729653 A TW 200729653A TW 095139420 A TW095139420 A TW 095139420A TW 95139420 A TW95139420 A TW 95139420A TW 200729653 A TW200729653 A TW 200729653A
Authority
TW
Taiwan
Prior art keywords
semiconductor device
semiconductor element
manufacturing
wiring board
metal plate
Prior art date
Application number
TW095139420A
Other languages
English (en)
Other versions
TWI329952B (en
Inventor
Kiyoshi Yamauchi
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200729653A publication Critical patent/TW200729653A/zh
Application granted granted Critical
Publication of TWI329952B publication Critical patent/TWI329952B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0232—Lead-frames
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
    • G11B7/127—Lasers; Multiple laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/0231—Stems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Lasers (AREA)
  • Wire Bonding (AREA)
TW095139420A 2005-11-02 2006-10-25 Semiconductor device and method of manufacturing semiconductor device TWI329952B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005319097A JP4238864B2 (ja) 2005-11-02 2005-11-02 半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW200729653A true TW200729653A (en) 2007-08-01
TWI329952B TWI329952B (en) 2010-09-01

Family

ID=37995093

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139420A TWI329952B (en) 2005-11-02 2006-10-25 Semiconductor device and method of manufacturing semiconductor device

Country Status (5)

Country Link
US (1) US8598597B2 (zh)
JP (1) JP4238864B2 (zh)
KR (1) KR20070047699A (zh)
CN (1) CN100446360C (zh)
TW (1) TWI329952B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100802393B1 (ko) * 2007-02-15 2008-02-13 삼성전기주식회사 패키지 기판 및 그 제조방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09289274A (ja) 1996-04-22 1997-11-04 Toppan Printing Co Ltd 半導体装置用基板とその製造方法
JP3684305B2 (ja) * 1998-09-17 2005-08-17 日本オプネクスト株式会社 半導体レーザ結合装置および半導体受光装置
US6787071B2 (en) * 2001-06-11 2004-09-07 General Electric Company Method and apparatus for producing data storage media
JP4330835B2 (ja) * 2001-12-28 2009-09-16 三菱電機株式会社 光ピックアップ装置
US6815308B2 (en) * 2002-08-15 2004-11-09 Micron Technology, Inc. Use of a dual-tone resist to form photomasks including alignment mark protection, intermediate semiconductor device structures and bulk semiconductor device substrates
JP3938742B2 (ja) 2002-11-18 2007-06-27 Ｎｅｃエレクトロニクス株式会社 電子部品装置及びその製造方法
JP3972814B2 (ja) 2002-12-26 2007-09-05 ソニー株式会社 半導体集積装置
CN100459188C (zh) * 2003-03-18 2009-02-04 住友电气工业株式会社 发光元件安装用构件以及使用该构件的半导体装置
CN100587560C (zh) * 2003-04-01 2010-02-03 夏普株式会社 发光装置用组件、发光装置、背侧光照射装置、显示装置
JP2005142189A (ja) * 2003-11-04 2005-06-02 Toyota Industries Corp 半導体装置
JP4380334B2 (ja) 2004-01-14 2009-12-09 株式会社デンソー 電子装置の製造方法
JP2005217186A (ja) * 2004-01-29 2005-08-11 Sharp Corp 半導体レーザ装置及びそれを用いた光ピックアップ
JP2005223189A (ja) * 2004-02-06 2005-08-18 Yamaha Corp 光半導体モジュール
US7095122B2 (en) * 2004-09-01 2006-08-22 Micron Technology, Inc. Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Also Published As

Publication number Publication date
CN1960088A (zh) 2007-05-09
TWI329952B (en) 2010-09-01
US20070096137A1 (en) 2007-05-03
US8598597B2 (en) 2013-12-03
CN100446360C (zh) 2008-12-24
JP4238864B2 (ja) 2009-03-18
JP2007129004A (ja) 2007-05-24
KR20070047699A (ko) 2007-05-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees