TW200729551A - System and method for LED manufacturing - Google Patents

System and method for LED manufacturing

Info

Publication number
TW200729551A
TW200729551A TW095138388A TW95138388A TW200729551A TW 200729551 A TW200729551 A TW 200729551A TW 095138388 A TW095138388 A TW 095138388A TW 95138388 A TW95138388 A TW 95138388A TW 200729551 A TW200729551 A TW 200729551A
Authority
TW
Taiwan
Prior art keywords
led
terminal leads
led manufacturing
light coming
light
Prior art date
Application number
TW095138388A
Other languages
English (en)
Inventor
Kian-Shin Lee
Meng-Ee Lee
Janet Bee-Yin Chua
Yew-Cheong Kuan
Original Assignee
Avago Tech Ecbu Ip Sg Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Tech Ecbu Ip Sg Pte Ltd filed Critical Avago Tech Ecbu Ip Sg Pte Ltd
Publication of TW200729551A publication Critical patent/TW200729551A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/67—Focus control based on electronic image sensor signals
    • H04N23/671—Focus control based on electronic image sensor signals in combination with active ranging signals, e.g. using light or sound signals emitted toward objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
TW095138388A 2005-11-02 2006-10-18 System and method for LED manufacturing TW200729551A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/265,335 US20070096133A1 (en) 2005-11-02 2005-11-02 System and method for LED manufacturing

Publications (1)

Publication Number Publication Date
TW200729551A true TW200729551A (en) 2007-08-01

Family

ID=37995091

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095138388A TW200729551A (en) 2005-11-02 2006-10-18 System and method for LED manufacturing

Country Status (3)

Country Link
US (1) US20070096133A1 (zh)
JP (1) JP2007129226A (zh)
TW (1) TW200729551A (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7948002B2 (en) * 2005-11-21 2011-05-24 Seoul Semiconductor Co., Ltd. Light emitting element
JP5230171B2 (ja) * 2007-06-05 2013-07-10 シャープ株式会社 発光装置、発光装置の製造方法、電子機器および携帯電話機
US8288936B2 (en) 2007-06-05 2012-10-16 Sharp Kabushiki Kaisha Light emitting apparatus, method for manufacturing the light emitting apparatus, electronic device and cell phone device
CN101533819B (zh) * 2008-03-14 2013-01-16 旭丽电子(广州)有限公司 半导体封装构造、应用于半导体封装构造的导线架及导电件
JP2010184021A (ja) * 2009-02-12 2010-08-26 Asahi Iryoki:Kk 鍼管つき鍼
US8610156B2 (en) * 2009-03-10 2013-12-17 Lg Innotek Co., Ltd. Light emitting device package
KR101047603B1 (ko) * 2009-03-10 2011-07-07 엘지이노텍 주식회사 발광 소자 패키지 및 그 제조방법
JP6224320B2 (ja) * 2012-12-19 2017-11-01 ローム株式会社 Ｌｅｄモジュール
CN103779485B (zh) * 2014-01-28 2017-01-18 深圳市蓝科电子有限公司 户外smd全彩led灯珠及其制造方法
JP6435031B2 (ja) * 2017-10-05 2018-12-05 ローム株式会社 Ｌｅｄモジュール

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69329223T2 (de) * 1992-08-05 2001-04-05 Motorola Inc Seitlich emittierende Superlumineszenzdiode
DE29825062U1 (de) * 1997-07-29 2004-07-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP4174823B2 (ja) * 2003-03-27 2008-11-05 サンケン電気株式会社 半導体発光装置

Also Published As

Publication number Publication date
US20070096133A1 (en) 2007-05-03
JP2007129226A (ja) 2007-05-24

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