TW200729394A - A method of forming a layer over a surface of a first material embedded in a second material in a structure for a semiconductor device - Google Patents

A method of forming a layer over a surface of a first material embedded in a second material in a structure for a semiconductor device

Info

Publication number
TW200729394A
TW200729394A TW095145051A TW95145051A TW200729394A TW 200729394 A TW200729394 A TW 200729394A TW 095145051 A TW095145051 A TW 095145051A TW 95145051 A TW95145051 A TW 95145051A TW 200729394 A TW200729394 A TW 200729394A
Authority
TW
Taiwan
Prior art keywords
semiconductor device
forming
vapour deposition
deposition step
layer over
Prior art date
Application number
TW095145051A
Other languages
English (en)
Inventor
Wim Besling
Sonarith Chhun
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Publication of TW200729394A publication Critical patent/TW200729394A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H01L21/76849—Barrier, adhesion or liner layers formed in openings in a dielectric the layer being positioned on top of the main fill metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
    • H01L21/28562—Selective deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76822—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc.
    • H01L21/76826—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc. by contacting the layer with gases, liquids or plasmas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76822—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc.
    • H01L21/76828—Modification of the material of dielectric layers, e.g. grading, after-treatment to improve the stability of the layers, to increase their density etc. thermal treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical Vapour Deposition (AREA)
TW095145051A 2005-12-07 2006-12-04 A method of forming a layer over a surface of a first material embedded in a second material in a structure for a semiconductor device TW200729394A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05301019 2005-12-07

Publications (1)

Publication Number Publication Date
TW200729394A true TW200729394A (en) 2007-08-01

Family

ID=37944289

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095145051A TW200729394A (en) 2005-12-07 2006-12-04 A method of forming a layer over a surface of a first material embedded in a second material in a structure for a semiconductor device

Country Status (7)

Country Link
US (1) US20090197405A1 (zh)
EP (1) EP1961042A2 (zh)
JP (1) JP2009518844A (zh)
KR (1) KR20080080612A (zh)
CN (1) CN101326630B (zh)
TW (1) TW200729394A (zh)
WO (1) WO2007066277A2 (zh)

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* Cited by examiner, † Cited by third party
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US7998864B2 (en) * 2008-01-29 2011-08-16 International Business Machines Corporation Noble metal cap for interconnect structures
US7932176B2 (en) 2008-03-21 2011-04-26 President And Fellows Of Harvard College Self-aligned barrier layers for interconnects
US8242019B2 (en) * 2009-03-31 2012-08-14 Tokyo Electron Limited Selective deposition of metal-containing cap layers for semiconductor devices
JP5507909B2 (ja) * 2009-07-14 2014-05-28 東京エレクトロン株式会社 成膜方法
KR101770537B1 (ko) * 2009-10-23 2017-08-22 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 상호 접속부를 위한 자기―정렬 배리어 및 캡핑 층
US8178439B2 (en) 2010-03-30 2012-05-15 Tokyo Electron Limited Surface cleaning and selective deposition of metal-containing cap layers for semiconductor devices
US8603913B1 (en) * 2012-12-20 2013-12-10 Lam Research Corporation Porous dielectrics K value restoration by thermal treatment and or solvent treatment
TWI686499B (zh) 2014-02-04 2020-03-01 荷蘭商Ａｓｍ Ｉｐ控股公司 金屬、金屬氧化物與介電質的選擇性沉積
CN104835778B (zh) * 2014-02-08 2017-12-05 中芯国际集成电路制造(上海)有限公司 一种半导体器件的制作方法
US10047435B2 (en) 2014-04-16 2018-08-14 Asm Ip Holding B.V. Dual selective deposition
US20160064275A1 (en) * 2014-08-27 2016-03-03 Applied Materials, Inc. Selective Deposition With Alcohol Selective Reduction And Protection
CN105575881B (zh) * 2014-10-11 2018-09-21 中芯国际集成电路制造(上海)有限公司 一种半导体器件的制作方法
US9659864B2 (en) * 2015-10-20 2017-05-23 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for forming self-aligned via with selectively deposited etching stop layer
US11081342B2 (en) 2016-05-05 2021-08-03 Asm Ip Holding B.V. Selective deposition using hydrophobic precursors
KR20170135760A (ko) * 2016-05-31 2017-12-08 도쿄엘렉트론가부시키가이샤 표면 처리에 의한 선택적 퇴적
US10580644B2 (en) * 2016-07-11 2020-03-03 Tokyo Electron Limited Method and apparatus for selective film deposition using a cyclic treatment
KR102271771B1 (ko) * 2017-05-25 2021-07-01 삼성전자주식회사 박막 형성 방법 및 이를 이용한 집적회로 소자의 제조 방법
CN109037482A (zh) * 2018-08-03 2018-12-18 武汉华星光电半导体显示技术有限公司 薄膜封装层的制备方法及oled显示装置
KR102124612B1 (ko) 2019-03-14 2020-06-18 최진욱 공기정화 시스템
KR20210131441A (ko) * 2019-04-30 2021-11-02 매슨 테크놀로지 인크 메틸화 처리를 사용한 선택적 증착
DE102021101486A1 (de) * 2020-03-30 2021-09-30 Taiwan Semiconductor Manufacturing Co., Ltd. Photoresistschicht-oberflächenbehandlung, abdeckschichtund herstellungsverfahren einer photoresiststruktur

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6506675B1 (en) * 1999-07-09 2003-01-14 Kabushiki Kaisha Toshiba Copper film selective formation method
US20040126482A1 (en) * 2002-12-31 2004-07-01 Chih-I Wu Method and structure for selective surface passivation
US20040152296A1 (en) * 2003-02-04 2004-08-05 Texas Instruments Incorporated Hexamethyldisilazane treatment of low-k dielectric films
US6844258B1 (en) * 2003-05-09 2005-01-18 Novellus Systems, Inc. Selective refractory metal and nitride capping
US20060033678A1 (en) * 2004-01-26 2006-02-16 Applied Materials, Inc. Integrated electroless deposition system
EP1820214A2 (en) * 2004-12-01 2007-08-22 Koninklijke Philips Electronics N.V. A method of forming an interconnect structure on an integrated circuit die
US7084060B1 (en) * 2005-05-04 2006-08-01 International Business Machines Corporation Forming capping layer over metal wire structure using selective atomic layer deposition

Also Published As

Publication number Publication date
US20090197405A1 (en) 2009-08-06
EP1961042A2 (en) 2008-08-27
KR20080080612A (ko) 2008-09-04
CN101326630B (zh) 2011-07-20
WO2007066277A2 (en) 2007-06-14
CN101326630A (zh) 2008-12-17
WO2007066277A3 (en) 2007-11-15
JP2009518844A (ja) 2009-05-07

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