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Application filed by Rokko Systems Pte LtdfiledCriticalRokko Systems Pte Ltd
Publication of TW200729324ApublicationCriticalpatent/TW200729324A/en
A system for singulating an IC unit from a substrate, said IC unit having a combination of linear and non-linear peripheral edges, said system comprising a profile cutting device for cutting the non-linear portions of the IC unit; a longitudinal cutting device for cutting the linear portions of the IC unit, said cutting means located within a singulation zone.
TW095148081A2005-12-202006-12-20Improved singulation system and method
TW200729324A
(en)
Information processing system, information processing method, and device and program used for the information processing system and the information processing method