TW200728402A - High adhesive polyimide film and a mehtod for preparing it - Google Patents

High adhesive polyimide film and a mehtod for preparing it

Info

Publication number
TW200728402A
TW200728402A TW095147866A TW95147866A TW200728402A TW 200728402 A TW200728402 A TW 200728402A TW 095147866 A TW095147866 A TW 095147866A TW 95147866 A TW95147866 A TW 95147866A TW 200728402 A TW200728402 A TW 200728402A
Authority
TW
Taiwan
Prior art keywords
polyimide film
mole
preparing
high adhesive
impressing
Prior art date
Application number
TW095147866A
Other languages
Chinese (zh)
Inventor
Naofumi Yasuda
Hiroki Ishikawa
Original Assignee
Du Pont Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont Toray Co Ltd filed Critical Du Pont Toray Co Ltd
Publication of TW200728402A publication Critical patent/TW200728402A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

This invention provides a high adhesive polyimide film and a method for preparing it. The said high adhesive polyimide film is formed by, using 20~40 mole% of paraphenylenediamine and 80~60 mole% of 4,4' -diaminodiphenyl ether as a diamine component, and 100 mole% of pyromellitic acid dianhydride as an acid component, and surface free energy measured based on the contact angle method is 80mN/m or more. The said method for preparing high adhesive polyimide film comprises, impressing high voltage under the atmosphere of 100~1000 torr that contains at least 20 mole% of rare gas while impressing plasma process on the surface of polyimide film, between high voltage impressing electrode with the surface covered by dielectric and cooled to 10 DEG C~100 DEG C and support electrode with the discharge forming face covered by dielectric, which are installed opposing each other, and continually plasma processing strength by high voltage impressed on the surface of a polyimide film at 500w. min/m2 and more.
TW095147866A 2005-12-22 2006-12-20 High adhesive polyimide film and a mehtod for preparing it TW200728402A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005369384 2005-12-22

Publications (1)

Publication Number Publication Date
TW200728402A true TW200728402A (en) 2007-08-01

Family

ID=38365873

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147866A TW200728402A (en) 2005-12-22 2006-12-20 High adhesive polyimide film and a mehtod for preparing it

Country Status (2)

Country Link
KR (1) KR20070066989A (en)
TW (1) TW200728402A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102147319B1 (en) 2019-09-30 2020-08-24 에스케이이노베이션 주식회사 Polyimide film and flexible display panel including the same

Also Published As

Publication number Publication date
KR20070066989A (en) 2007-06-27

Similar Documents

Publication Publication Date Title
CN101484513B (en) Method of modifying surface of polyimide resin layer and method for producing metal-clad laminated plate
US20080038522A1 (en) Polyimide film and polyimide composite sheet
WO2006107417A3 (en) Method and system for forming a high-k dielectric layer
PH12015500539A1 (en) Plasma source and methods for despositing thin film coatings using plasma enhanced chemical vapor deposition
TW200710989A (en) Plasma etching apparatus
CN107073891A (en) Silane coupler layer stackup polymeric membrane
TWI580712B (en) Polyimide film
SG170697A1 (en) Edge-clamped and mechanically fastened inner electrode of showerhead electrode assembly
WO2011108542A1 (en) Polyimide film, laminate using same, and flexible thin-film solar cell
TW200707848A (en) Complex porous resin substrate and a method of fabricating the same
WO2011125563A1 (en) Polyimide film and method for producing polyimide film
WO2011021639A1 (en) Polyimide film and process for producing polyimide film
TW200502094A (en) Thin film lamination-delamination process for fluoropolymers
KR20230157271A (en) Polyimide film
CN110709245B (en) Laminate of polyimide film and inorganic substrate
KR101206352B1 (en) Fabrication method of flexible board
TW200728402A (en) High adhesive polyimide film and a mehtod for preparing it
WO2015105188A1 (en) Gas barrier film and electronic device comprising same
Lock et al. Dry graphene transfer print to polystyrene and ultra-high molecular weight polyethylene− Detailed chemical, structural, morphological and electrical characterization
JP2020007549A (en) Polyimide film
TW200722874A (en) Method for manufacturing alignment layer of liquid crystal panel
JP2016120663A (en) Glass-film laminate and production method therefor
JP5830896B2 (en) Method for producing polyimide film and polyimide film
JP5709018B2 (en) Metal laminate
TW200732393A (en) Low heat contractility and high adhesive polyimide film