TW200727755A - Method for monitoring the filling performance of copper plating formular - Google Patents
Method for monitoring the filling performance of copper plating formularInfo
- Publication number
- TW200727755A TW200727755A TW095100629A TW95100629A TW200727755A TW 200727755 A TW200727755 A TW 200727755A TW 095100629 A TW095100629 A TW 095100629A TW 95100629 A TW95100629 A TW 95100629A TW 200727755 A TW200727755 A TW 200727755A
- Authority
- TW
- Taiwan
- Prior art keywords
- filling performance
- monitoring
- copper plating
- rotation speed
- formular
- Prior art date
Links
Abstract
A method for monitoring the filling performance of a copper plating formula includes measuring a first relative potential value at a first rotation speed, and a second relative potential value at a second rotation speed by using a copper rotating disk electrode. Then, a potential difference is obtained by calculating the potential measured at the second rotation speed and the first rotation speed. The filling performance is defined by the potential difference; that is, a high potential difference indicates a high filling performance.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95100629A TWI292295B (en) | 2006-01-06 | 2006-01-06 | Method for monitoring the filling performance of copper plating formular |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95100629A TWI292295B (en) | 2006-01-06 | 2006-01-06 | Method for monitoring the filling performance of copper plating formular |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200727755A true TW200727755A (en) | 2007-07-16 |
TWI292295B TWI292295B (en) | 2008-01-01 |
Family
ID=45067484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95100629A TWI292295B (en) | 2006-01-06 | 2006-01-06 | Method for monitoring the filling performance of copper plating formular |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI292295B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI561685B (en) * | 2015-06-03 | 2016-12-11 | Univ Nat United |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI455667B (en) * | 2012-12-07 | 2014-10-01 | Univ Nat United | Electronic component copper micro - plating rapid monitoring method |
CN103698372B (en) * | 2013-12-17 | 2016-02-10 | 上海交通大学 | The evaluation method of copper-connection plating filling effect |
-
2006
- 2006-01-06 TW TW95100629A patent/TWI292295B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI561685B (en) * | 2015-06-03 | 2016-12-11 | Univ Nat United |
Also Published As
Publication number | Publication date |
---|---|
TWI292295B (en) | 2008-01-01 |
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