TW200727755A - Method for monitoring the filling performance of copper plating formular - Google Patents

Method for monitoring the filling performance of copper plating formular

Info

Publication number
TW200727755A
TW200727755A TW095100629A TW95100629A TW200727755A TW 200727755 A TW200727755 A TW 200727755A TW 095100629 A TW095100629 A TW 095100629A TW 95100629 A TW95100629 A TW 95100629A TW 200727755 A TW200727755 A TW 200727755A
Authority
TW
Taiwan
Prior art keywords
filling performance
monitoring
copper plating
rotation speed
formular
Prior art date
Application number
TW095100629A
Other languages
Chinese (zh)
Other versions
TWI292295B (en
Inventor
Wei-Ping Dow
Cheng-Wei Liu
Original Assignee
Rockwood Electrochemicals Asia Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rockwood Electrochemicals Asia Ltd filed Critical Rockwood Electrochemicals Asia Ltd
Priority to TW95100629A priority Critical patent/TWI292295B/en
Publication of TW200727755A publication Critical patent/TW200727755A/en
Application granted granted Critical
Publication of TWI292295B publication Critical patent/TWI292295B/en

Links

Abstract

A method for monitoring the filling performance of a copper plating formula includes measuring a first relative potential value at a first rotation speed, and a second relative potential value at a second rotation speed by using a copper rotating disk electrode. Then, a potential difference is obtained by calculating the potential measured at the second rotation speed and the first rotation speed. The filling performance is defined by the potential difference; that is, a high potential difference indicates a high filling performance.
TW95100629A 2006-01-06 2006-01-06 Method for monitoring the filling performance of copper plating formular TWI292295B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95100629A TWI292295B (en) 2006-01-06 2006-01-06 Method for monitoring the filling performance of copper plating formular

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95100629A TWI292295B (en) 2006-01-06 2006-01-06 Method for monitoring the filling performance of copper plating formular

Publications (2)

Publication Number Publication Date
TW200727755A true TW200727755A (en) 2007-07-16
TWI292295B TWI292295B (en) 2008-01-01

Family

ID=45067484

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95100629A TWI292295B (en) 2006-01-06 2006-01-06 Method for monitoring the filling performance of copper plating formular

Country Status (1)

Country Link
TW (1) TWI292295B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561685B (en) * 2015-06-03 2016-12-11 Univ Nat United

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI455667B (en) * 2012-12-07 2014-10-01 Univ Nat United Electronic component copper micro - plating rapid monitoring method
CN103698372B (en) * 2013-12-17 2016-02-10 上海交通大学 The evaluation method of copper-connection plating filling effect

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561685B (en) * 2015-06-03 2016-12-11 Univ Nat United

Also Published As

Publication number Publication date
TWI292295B (en) 2008-01-01

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