TW200727512A - LED package structure and manufacturing method thereof - Google Patents

LED package structure and manufacturing method thereof

Info

Publication number
TW200727512A
TW200727512A TW095101332A TW95101332A TW200727512A TW 200727512 A TW200727512 A TW 200727512A TW 095101332 A TW095101332 A TW 095101332A TW 95101332 A TW95101332 A TW 95101332A TW 200727512 A TW200727512 A TW 200727512A
Authority
TW
Taiwan
Prior art keywords
package
shell
led
manufacturing
package structure
Prior art date
Application number
TW095101332A
Other languages
Chinese (zh)
Other versions
TWI299916B (en
Inventor
Zong-Ding Sun
Hung-Ta Liao
Tz-Shiuan Yan
hong-xun Zhou
Guo-Shi Xu
Original Assignee
Edison Opto Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Edison Opto Corp filed Critical Edison Opto Corp
Priority to TW095101332A priority Critical patent/TW200727512A/en
Publication of TW200727512A publication Critical patent/TW200727512A/en
Application granted granted Critical
Publication of TWI299916B publication Critical patent/TWI299916B/zh

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

A LED package structure with heat-reducing shield and manufacturing method thereof. It includes a base, a LED grain, a plastic package shell, and a package material. The plastic package shell is bowl-like and has an injection hole. After positioning the LED grain on the base, the plastic package shell covers the base and completely seals the grain. Then the package material is injected from the injection hole until the package material is completely filled with the shell to form a package shield. Finally, through removing the plastic package shell, the LED package structure is achieved.
TW095101332A 2006-01-13 2006-01-13 LED package structure and manufacturing method thereof TW200727512A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095101332A TW200727512A (en) 2006-01-13 2006-01-13 LED package structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095101332A TW200727512A (en) 2006-01-13 2006-01-13 LED package structure and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW200727512A true TW200727512A (en) 2007-07-16
TWI299916B TWI299916B (en) 2008-08-11

Family

ID=45069823

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101332A TW200727512A (en) 2006-01-13 2006-01-13 LED package structure and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TW200727512A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI416767B (en) * 2009-06-03 2013-11-21 Kwo Ger Metal Technology Inc LED luminous module process method

Also Published As

Publication number Publication date
TWI299916B (en) 2008-08-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees