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Application filed by Edison Opto CorpfiledCriticalEdison Opto Corp
Priority to TW095101332ApriorityCriticalpatent/TW200727512A/en
Publication of TW200727512ApublicationCriticalpatent/TW200727512A/en
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Publication of TWI299916BpublicationCriticalpatent/TWI299916B/zh
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices
(AREA)
Led Device Packages
(AREA)
Abstract
A LED package structure with heat-reducing shield and manufacturing method thereof. It includes a base, a LED grain, a plastic package shell, and a package material. The plastic package shell is bowl-like and has an injection hole. After positioning the LED grain on the base, the plastic package shell covers the base and completely seals the grain. Then the package material is injected from the injection hole until the package material is completely filled with the shell to form a package shield. Finally, through removing the plastic package shell, the LED package structure is achieved.
TW095101332A2006-01-132006-01-13LED package structure and manufacturing method thereof
TW200727512A
(en)
Gas-barrier film, process for producing gas-barrier film, resin base with the gas-barrier film for organic electroluminescent element, and organic electroluminescent element
Gas barrier film, resin base for organic electroluminescent device, organic electroluminescent device using the same, and method for producing gas barrier film
Light-emitting material for organic electroluminescent device, organic electroluminescent device using same, and material for organic electroluminescent device