TW200725776A - Wafer holder, heater having wafer holder, and wafer probe having heater - Google Patents

Wafer holder, heater having wafer holder, and wafer probe having heater

Info

Publication number
TW200725776A
TW200725776A TW095128735A TW95128735A TW200725776A TW 200725776 A TW200725776 A TW 200725776A TW 095128735 A TW095128735 A TW 095128735A TW 95128735 A TW95128735 A TW 95128735A TW 200725776 A TW200725776 A TW 200725776A
Authority
TW
Taiwan
Prior art keywords
holder
wafer
heater
wafer holder
tray
Prior art date
Application number
TW095128735A
Other languages
Chinese (zh)
Inventor
Katsuhiro Itakura
Masuhiro Natsuhara
Hirohiko Nakata
Tomoyuki Awazu
Teruto Nishi
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005226202A external-priority patent/JP2007042908A/en
Priority claimed from JP2005227335A external-priority patent/JP4155288B2/en
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200725776A publication Critical patent/TW200725776A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention provides a wafer holder for rapid heating and cooling, a heater having the wafer holder, and a wafer probe having the heater. The deformation is less even applying high load. It can increase the position precision or increase the uniform heat property by the effect of high heat insulation. The characteristic of wafer holder of this invention is containing tray clipping head with conductor layer and holder to support the tray clipping head. The gap portion between the tray clipping head and the holder has a supporting component. Preferably, the supporting component is disposed in concentric circles with the holder or located at approximately center in the holder.
TW095128735A 2005-08-04 2006-08-04 Wafer holder, heater having wafer holder, and wafer probe having heater TW200725776A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005226202A JP2007042908A (en) 2005-08-04 2005-08-04 Wafer holder and wafer prober mounted with the same
JP2005227335A JP4155288B2 (en) 2004-11-30 2005-08-05 Wafer holder and wafer prober equipped with the same

Publications (1)

Publication Number Publication Date
TW200725776A true TW200725776A (en) 2007-07-01

Family

ID=37911398

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128735A TW200725776A (en) 2005-08-04 2006-08-04 Wafer holder, heater having wafer holder, and wafer probe having heater

Country Status (2)

Country Link
US (1) US20070082313A1 (en)
TW (1) TW200725776A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8409743B2 (en) * 2007-11-28 2013-04-02 Sanyo Electric Co., Ltd. Battery system with battery cells arranged in array alignment
JP5147373B2 (en) * 2007-11-29 2013-02-20 三洋電機株式会社 Battery system
US11280827B2 (en) * 2016-02-29 2022-03-22 Teradyne, Inc. Thermal control of a probe card assembly
US10161667B1 (en) * 2017-11-15 2018-12-25 Haier Us Appliance Solutions, Inc. Refrigerator appliance having a defrost chamber

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4641569B2 (en) * 1998-07-24 2011-03-02 日本碍子株式会社 Aluminum nitride sintered body, corrosion resistant member, metal burying and semiconductor holding device
US6847014B1 (en) * 2001-04-30 2005-01-25 Lam Research Corporation Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
US20030089457A1 (en) * 2001-11-13 2003-05-15 Applied Materials, Inc. Apparatus for controlling a thermal conductivity profile for a pedestal in a semiconductor wafer processing chamber

Also Published As

Publication number Publication date
US20070082313A1 (en) 2007-04-12

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