TW200725714A - Systems, methods and slurries for chemical mechanical polishing - Google Patents

Systems, methods and slurries for chemical mechanical polishing

Info

Publication number
TW200725714A
TW200725714A TW094145496A TW94145496A TW200725714A TW 200725714 A TW200725714 A TW 200725714A TW 094145496 A TW094145496 A TW 094145496A TW 94145496 A TW94145496 A TW 94145496A TW 200725714 A TW200725714 A TW 200725714A
Authority
TW
Taiwan
Prior art keywords
slurries
methods
mechanical polishing
chemical mechanical
systems
Prior art date
Application number
TW094145496A
Other languages
English (en)
Other versions
TWI408739B (zh
Inventor
Andy Chun-Xiao Yang
Chris Chang Yu
Original Assignee
Anji Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anji Microelectronics Co Ltd filed Critical Anji Microelectronics Co Ltd
Priority to TW94145496A priority Critical patent/TWI408739B/zh
Publication of TW200725714A publication Critical patent/TW200725714A/zh
Application granted granted Critical
Publication of TWI408739B publication Critical patent/TWI408739B/zh

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW94145496A 2005-12-21 2005-12-21 化學機械拋光系統、方法以及研磨劑 TWI408739B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94145496A TWI408739B (zh) 2005-12-21 2005-12-21 化學機械拋光系統、方法以及研磨劑

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94145496A TWI408739B (zh) 2005-12-21 2005-12-21 化學機械拋光系統、方法以及研磨劑

Publications (2)

Publication Number Publication Date
TW200725714A true TW200725714A (en) 2007-07-01
TWI408739B TWI408739B (zh) 2013-09-11

Family

ID=49626750

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94145496A TWI408739B (zh) 2005-12-21 2005-12-21 化學機械拋光系統、方法以及研磨劑

Country Status (1)

Country Link
TW (1) TWI408739B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI596668B (zh) * 2016-10-14 2017-08-21 上海新昇半導體科技有限公司 一種半導體晶圓的拋光方法
CN115558426A (zh) * 2022-09-23 2023-01-03 无锡兴华衡辉科技有限公司 芯片表面研磨的方法、用于芯片表面研磨的悬浮磨抛液及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW455626B (en) * 1998-07-23 2001-09-21 Eternal Chemical Co Ltd Chemical mechanical abrasive composition for use in semiconductor processing
US7097541B2 (en) * 2002-01-22 2006-08-29 Cabot Microelectronics Corporation CMP method for noble metals
JP2004247605A (ja) * 2003-02-14 2004-09-02 Toshiba Corp Ｃｍｐ用スラリーおよび半導体装置の製造方法
TWI234199B (en) * 2003-07-02 2005-06-11 Qualitech Materials Corp A slurry for chemical mechanical polishing process
US7470295B2 (en) * 2004-03-12 2008-12-30 K.C. Tech Co., Ltd. Polishing slurry, method of producing same, and method of polishing substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI596668B (zh) * 2016-10-14 2017-08-21 上海新昇半導體科技有限公司 一種半導體晶圓的拋光方法
CN115558426A (zh) * 2022-09-23 2023-01-03 无锡兴华衡辉科技有限公司 芯片表面研磨的方法、用于芯片表面研磨的悬浮磨抛液及其制备方法

Also Published As

Publication number Publication date
TWI408739B (zh) 2013-09-11

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees