TW200724285A - Solder fixture of PCB - Google Patents
Solder fixture of PCBInfo
- Publication number
- TW200724285A TW200724285A TW094146837A TW94146837A TW200724285A TW 200724285 A TW200724285 A TW 200724285A TW 094146837 A TW094146837 A TW 094146837A TW 94146837 A TW94146837 A TW 94146837A TW 200724285 A TW200724285 A TW 200724285A
- Authority
- TW
- Taiwan
- Prior art keywords
- pcb
- solder fixture
- build
- stripping module
- solder
- Prior art date
Links
Abstract
A solder fixture of a PCB includes a stripping module in the frame. The stripping module is detachable from the frame and located near the hole which easily build-up solders. By the material of solderability, the stripping module would build-up potential solders to avoid build-up in PCB.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94146837A TWI274621B (en) | 2005-12-27 | 2005-12-27 | Solder fixture of PCB |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94146837A TWI274621B (en) | 2005-12-27 | 2005-12-27 | Solder fixture of PCB |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI274621B TWI274621B (en) | 2007-03-01 |
TW200724285A true TW200724285A (en) | 2007-07-01 |
Family
ID=38624068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94146837A TWI274621B (en) | 2005-12-27 | 2005-12-27 | Solder fixture of PCB |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI274621B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI472396B (en) * | 2012-10-12 | 2015-02-11 |
-
2005
- 2005-12-27 TW TW94146837A patent/TWI274621B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI472396B (en) * | 2012-10-12 | 2015-02-11 |
Also Published As
Publication number | Publication date |
---|---|
TWI274621B (en) | 2007-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |