TW200724256A - Forming mold and method of formin - Google Patents

Forming mold and method of formin

Info

Publication number
TW200724256A
TW200724256A TW094145768A TW94145768A TW200724256A TW 200724256 A TW200724256 A TW 200724256A TW 094145768 A TW094145768 A TW 094145768A TW 94145768 A TW94145768 A TW 94145768A TW 200724256 A TW200724256 A TW 200724256A
Authority
TW
Taiwan
Prior art keywords
forming
chip package
forming mold
buffers
formin
Prior art date
Application number
TW094145768A
Other languages
Chinese (zh)
Inventor
Chia-Ming Chang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW094145768A priority Critical patent/TW200724256A/en
Publication of TW200724256A publication Critical patent/TW200724256A/en

Links

Abstract

A forming mold is used for the punch forming of multiple outer leads of a chip package. The forming mold includes a bottom part, a top part, and at least a punching cutter. The bottom part has a forming part. The top part has a press surface and multiple buffers. The buffers are disposed on the press surface and correspondingly contact a top surface of the chip package. The forming part and the buffers are suitable for pressing each other to fix the chip package. The punching cutter is corresponding to the outer leads of the chip package and used for punching and forming the outer leads.
TW094145768A 2005-12-22 2005-12-22 Forming mold and method of formin TW200724256A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094145768A TW200724256A (en) 2005-12-22 2005-12-22 Forming mold and method of formin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094145768A TW200724256A (en) 2005-12-22 2005-12-22 Forming mold and method of formin

Publications (1)

Publication Number Publication Date
TW200724256A true TW200724256A (en) 2007-07-01

Family

ID=57912340

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145768A TW200724256A (en) 2005-12-22 2005-12-22 Forming mold and method of formin

Country Status (1)

Country Link
TW (1) TW200724256A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115519683A (en) * 2022-09-26 2022-12-27 深圳市埃芯半导体科技有限公司 Curved surface curved crystal preparation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115519683A (en) * 2022-09-26 2022-12-27 深圳市埃芯半导体科技有限公司 Curved surface curved crystal preparation device
CN115519683B (en) * 2022-09-26 2023-08-25 深圳市埃芯半导体科技有限公司 Curved surface bent crystal preparation device

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