TW200724256A - Forming mold and method of formin - Google Patents
Forming mold and method of forminInfo
- Publication number
- TW200724256A TW200724256A TW094145768A TW94145768A TW200724256A TW 200724256 A TW200724256 A TW 200724256A TW 094145768 A TW094145768 A TW 094145768A TW 94145768 A TW94145768 A TW 94145768A TW 200724256 A TW200724256 A TW 200724256A
- Authority
- TW
- Taiwan
- Prior art keywords
- forming
- chip package
- forming mold
- buffers
- formin
- Prior art date
Links
Abstract
A forming mold is used for the punch forming of multiple outer leads of a chip package. The forming mold includes a bottom part, a top part, and at least a punching cutter. The bottom part has a forming part. The top part has a press surface and multiple buffers. The buffers are disposed on the press surface and correspondingly contact a top surface of the chip package. The forming part and the buffers are suitable for pressing each other to fix the chip package. The punching cutter is corresponding to the outer leads of the chip package and used for punching and forming the outer leads.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094145768A TW200724256A (en) | 2005-12-22 | 2005-12-22 | Forming mold and method of formin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094145768A TW200724256A (en) | 2005-12-22 | 2005-12-22 | Forming mold and method of formin |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200724256A true TW200724256A (en) | 2007-07-01 |
Family
ID=57912340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094145768A TW200724256A (en) | 2005-12-22 | 2005-12-22 | Forming mold and method of formin |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200724256A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115519683A (en) * | 2022-09-26 | 2022-12-27 | 深圳市埃芯半导体科技有限公司 | Curved surface curved crystal preparation device |
-
2005
- 2005-12-22 TW TW094145768A patent/TW200724256A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115519683A (en) * | 2022-09-26 | 2022-12-27 | 深圳市埃芯半导体科技有限公司 | Curved surface curved crystal preparation device |
CN115519683B (en) * | 2022-09-26 | 2023-08-25 | 深圳市埃芯半导体科技有限公司 | Curved surface bent crystal preparation device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG102639A1 (en) | Apparatus and method for packing circuits | |
TW200739854A (en) | Substrate structure having solder mask layer and process for making the same | |
WO2007064848A3 (en) | Process for making an orthodontic band | |
CN202316763U (en) | Die for machining bottom plate of washing machine | |
TW200733277A (en) | Clipless and wireless semiconductor die package and method for making the same | |
PT1763413E (en) | Method and device for the production of stamped parts | |
EP2314461A3 (en) | Patterning apparatus and patterning method using the same | |
TW200704489A (en) | Punching die for manufacturing seal member and method for manufacturing seal member (Ⅱ) | |
TW200503224A (en) | Device and method for fabricating lead frame by press forming, and resultant lead frame | |
WO2009038998A3 (en) | Staged tooling technology | |
WO2007131906A3 (en) | Tabletting machine | |
CN107052137A (en) | A kind of brake dust side-cutting die | |
WO2008039717A3 (en) | Semiconductor dies and methods and apparatus to mold lock a semiconductor die | |
CN201082444Y (en) | Device for forming round-smooth roll rim for metal sheet eyelet work | |
EP1529576A4 (en) | Punch press die | |
TW200724256A (en) | Forming mold and method of formin | |
AU5495201A (en) | Process and press for the production of tablets | |
ATE402899T1 (en) | INLINE COLLECTION PRESS PADDDING MACHINE | |
WO2008081613A1 (en) | Punching die | |
EP1472093A4 (en) | A die plate for a foil stamping machine | |
CN207343596U (en) | A kind of shutter stamping die | |
CN201783996U (en) | Device for blanking rubber materials | |
CN204320959U (en) | A kind of Cold pressing die lamps structure | |
TW200633087A (en) | Die structure of package and method of manufacturing the same | |
AU2002358566A8 (en) | Bipolar plate, press device and method for production thereof |