Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res InstfiledCriticalInd Tech Res Inst
Priority to TW094144405ApriorityCriticalpatent/TW200723978A/en
Publication of TW200723978ApublicationCriticalpatent/TW200723978A/en
This invention discloses a method of cutting flexible circuit board (FCB), using a laser cutting system. Firstly, a FCB is fixed on the work platform of the laser cutting system. At the same time, the positioning tool on the work platform and on a FCB can be used to form positioning holes. The positioning hole can be used to position the FCB and the positioning tool. According to the positioning hole, cutting points can be obtained. Finally, a laser source can be used to cut the FCB. This invention is to use a precise controlling method to meet the need of a procedure, and this invention can overcome the shortcoming of a traditional method.
TW094144405A2005-12-152005-12-15Method of cutting flexible circuit board
TW200723978A
(en)