TW200723419A - Lead-free solder bump - Google Patents

Lead-free solder bump

Info

Publication number
TW200723419A
TW200723419A TW094142246A TW94142246A TW200723419A TW 200723419 A TW200723419 A TW 200723419A TW 094142246 A TW094142246 A TW 094142246A TW 94142246 A TW94142246 A TW 94142246A TW 200723419 A TW200723419 A TW 200723419A
Authority
TW
Taiwan
Prior art keywords
solder bump
lead
free solder
bump
silver
Prior art date
Application number
TW094142246A
Other languages
Chinese (zh)
Other versions
TWI299533B (en
Inventor
Don-Son Jiang
Yu-Po Wang
Cheng-Hsu Hsiao
Ke-Chuan Yang
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Priority to TW094142246A priority Critical patent/TWI299533B/en
Publication of TW200723419A publication Critical patent/TW200723419A/en
Application granted granted Critical
Publication of TWI299533B publication Critical patent/TWI299533B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

A lead-free solder bump is provided, which is a Tin-Silver-Copper (Sn-Ag-Cu) bump, wherein a silver (Ag) content thereof is less than or equal to 2 wt%. Thus, ductility of the lead-free solder bump can be increased by decreasing the silver (Ag) content. Furthermore, at least one trace element selected from stibium (Sb), zinc (Zn), nickel (Ni), and germanium (Ge) is incorporated into the lead-free solder bump with a content less than or equal to 1 wt%. A thickness of an intermetallic compound (IMC) formed between the lead-free solder bump and a bump pad where the solder bump is mounted can therefore be reduced to provide the entire solder bump structure with additional stress endurance, so as to increase reliability of packaged products.
TW094142246A 2005-12-01 2005-12-01 Lead-free solder bump TWI299533B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094142246A TWI299533B (en) 2005-12-01 2005-12-01 Lead-free solder bump

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094142246A TWI299533B (en) 2005-12-01 2005-12-01 Lead-free solder bump

Publications (2)

Publication Number Publication Date
TW200723419A true TW200723419A (en) 2007-06-16
TWI299533B TWI299533B (en) 2008-08-01

Family

ID=45069715

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142246A TWI299533B (en) 2005-12-01 2005-12-01 Lead-free solder bump

Country Status (1)

Country Link
TW (1) TWI299533B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684017B (en) * 2018-02-13 2020-02-01 矽品精密工業股份有限公司 Bump testing apparatus and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684017B (en) * 2018-02-13 2020-02-01 矽品精密工業股份有限公司 Bump testing apparatus and method

Also Published As

Publication number Publication date
TWI299533B (en) 2008-08-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees