TW200723377A - Methods and apparatus for processing wafers - Google Patents

Methods and apparatus for processing wafers

Info

Publication number
TW200723377A
TW200723377A TW095105904A TW95105904A TW200723377A TW 200723377 A TW200723377 A TW 200723377A TW 095105904 A TW095105904 A TW 095105904A TW 95105904 A TW95105904 A TW 95105904A TW 200723377 A TW200723377 A TW 200723377A
Authority
TW
Taiwan
Prior art keywords
support
methods
processing wafers
wafers
wafer
Prior art date
Application number
TW095105904A
Other languages
Chinese (zh)
Other versions
TWI386985B (en
Inventor
Nicholas John
Kevin Powell
David Andrew Tossell
Original Assignee
Aviza Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aviza Technology Ltd filed Critical Aviza Technology Ltd
Publication of TW200723377A publication Critical patent/TW200723377A/en
Application granted granted Critical
Publication of TWI386985B publication Critical patent/TWI386985B/en

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

A method of processing wafers or batches of wafers sequentially in a vacuum chamber (10). The method involves removing a wafer (25) from a location on a support (11); chemically cleaning particles from the support to form volatile components; and placing the subsequent wafer on the cleaned support. The method is performed without a vacuum break.
TW95105904A 2005-02-22 2006-02-22 Methods and apparatus for processing wafers TWI386985B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US65450905P 2005-02-22 2005-02-22

Publications (2)

Publication Number Publication Date
TW200723377A true TW200723377A (en) 2007-06-16
TWI386985B TWI386985B (en) 2013-02-21

Family

ID=48222421

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95105904A TWI386985B (en) 2005-02-22 2006-02-22 Methods and apparatus for processing wafers

Country Status (1)

Country Link
TW (1) TWI386985B (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5507874A (en) * 1994-06-03 1996-04-16 Applied Materials, Inc. Method of cleaning of an electrostatic chuck in plasma reactors
US5978078A (en) * 1996-12-17 1999-11-02 Texas Instruments Incorporated System and method for detecting particles on substrate-supporting chucks of photolithography equipment
JP3535785B2 (en) * 1999-11-26 2004-06-07 Ｎｅｃエレクトロニクス株式会社 Cleaning end point detection device and cleaning end point detection method

Also Published As

Publication number Publication date
TWI386985B (en) 2013-02-21

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