TW200721872A - Microelectromechanical microphone and package method thereof - Google Patents
Microelectromechanical microphone and package method thereofInfo
- Publication number
- TW200721872A TW200721872A TW094141012A TW94141012A TW200721872A TW 200721872 A TW200721872 A TW 200721872A TW 094141012 A TW094141012 A TW 094141012A TW 94141012 A TW94141012 A TW 94141012A TW 200721872 A TW200721872 A TW 200721872A
- Authority
- TW
- Taiwan
- Prior art keywords
- conductive layer
- signal
- substrate
- disposed
- frame
- Prior art date
Links
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Micromachines (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The present invention relates to "a microelectromechanical microphone and package method thereof." The microphone includes a substrate and a cover. A frame with a first conductive layer is disposed on one side of the substrate; an audio sensing device and an integrated circuit (IC) device are disposed inside the frame; the audio sensing device is used to sense an audio signal and convert the audio signal into an electronic signal; the IC device performs impedance matching or signal amplification on the electronic signal; a ground device is disposed on the substrate; the IC device is covered with a non-conductive layer; a second conductive layer is disposed between the ground device and the first conductive layer to form an electrically conducting state; the cover is dispose on the frame of the substrate. Therefore, the non-conductive layer can prevent the IC device from being corrosive due to the effect of moisture, and the first and second conductive layers can be bundled with the ground device to provide the protection against electrical interference signal, thereby preventing the IC device from being interfered by electrical interference signal, such as electromagnetic interference.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094141012A TW200721872A (en) | 2005-11-22 | 2005-11-22 | Microelectromechanical microphone and package method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094141012A TW200721872A (en) | 2005-11-22 | 2005-11-22 | Microelectromechanical microphone and package method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200721872A true TW200721872A (en) | 2007-06-01 |
TWI299961B TWI299961B (en) | 2008-08-11 |
Family
ID=45069839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094141012A TW200721872A (en) | 2005-11-22 | 2005-11-22 | Microelectromechanical microphone and package method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200721872A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101325823B (en) * | 2007-06-11 | 2011-08-17 | 美律实业股份有限公司 | Encapsulation construction for silicon crystal microphone |
CN113853802A (en) * | 2019-05-23 | 2021-12-28 | 星电株式会社 | Substrate and microphone unit |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI573469B (en) * | 2012-02-22 | 2017-03-01 | 美律實業股份有限公司 | Mems microphone module |
-
2005
- 2005-11-22 TW TW094141012A patent/TW200721872A/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101325823B (en) * | 2007-06-11 | 2011-08-17 | 美律实业股份有限公司 | Encapsulation construction for silicon crystal microphone |
CN113853802A (en) * | 2019-05-23 | 2021-12-28 | 星电株式会社 | Substrate and microphone unit |
Also Published As
Publication number | Publication date |
---|---|
TWI299961B (en) | 2008-08-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200701264A (en) | Inductor | |
TW200713529A (en) | Semiconductor device and its manufacturing method | |
WO2008027888A3 (en) | Radio frequency and electromagnetic interference shielding | |
WO2008043012A3 (en) | Package-level electromagnetic interference shielding | |
WO2007130790A3 (en) | Process condition measuring device with shielding | |
JP2008514012A5 (en) | ||
CA2579818A1 (en) | Field device incorporating circuit card assembly as environmental and emi/rfi shield | |
TW200513650A (en) | Micro-electromechanical probe circuit film, method for making the same and applications thereof | |
WO2009143126A3 (en) | Integrated circuit package having integrated faraday shield | |
ATE484235T1 (en) | HERMETIC FEEDTHROUGH FOR AN IMPLANTABLE DEVICE | |
ATE359566T1 (en) | SENSOR MODULE FOR SURFACE MEASURING | |
TW200742249A (en) | Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus | |
TW200505327A (en) | Electronic device, information processor, and electromagnetic radiation suppressing member | |
TW200629662A (en) | Electronic device package and electronic equipment | |
US8576536B2 (en) | Device for protecting an electronic printed circuit board | |
WO2008011254A3 (en) | Electrostatic discharge protection for components of an rfid tag | |
TW200735296A (en) | Microelectromechanical microphone packaging system | |
TW200740331A (en) | Hybrid multilayer circuit board and method of manufacturing the same | |
WO2007134308A3 (en) | Thin film battery on an integrated circuit or circuit board and method thereof | |
TW200608476A (en) | Electronic device having pin electrode with slight warpage | |
JP2009520368A5 (en) | ||
GB2483180A (en) | Integrated circuit package having security feature and method of manufacturing same | |
ATE474279T1 (en) | DEVICE FOR SHIELDING AGAINST INTERFERENCE FROM ELECTRICAL DEVICES | |
WO2009001170A3 (en) | Filter having impedance matching circuits | |
WO2009098373A3 (en) | Assembly for detecting electric discontinuity between an electric contact and an electrically conducting member |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |