TW200721872A - Microelectromechanical microphone and package method thereof - Google Patents

Microelectromechanical microphone and package method thereof

Info

Publication number
TW200721872A
TW200721872A TW094141012A TW94141012A TW200721872A TW 200721872 A TW200721872 A TW 200721872A TW 094141012 A TW094141012 A TW 094141012A TW 94141012 A TW94141012 A TW 94141012A TW 200721872 A TW200721872 A TW 200721872A
Authority
TW
Taiwan
Prior art keywords
conductive layer
signal
substrate
disposed
frame
Prior art date
Application number
TW094141012A
Other languages
Chinese (zh)
Other versions
TWI299961B (en
Inventor
wen-jie Wei
Hong-Ching Her
Shih-Chin Gong
Chih-Wei Chang
Original Assignee
Merry Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merry Electronics Co Ltd filed Critical Merry Electronics Co Ltd
Priority to TW094141012A priority Critical patent/TW200721872A/en
Publication of TW200721872A publication Critical patent/TW200721872A/en
Application granted granted Critical
Publication of TWI299961B publication Critical patent/TWI299961B/zh

Links

Landscapes

  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

The present invention relates to "a microelectromechanical microphone and package method thereof." The microphone includes a substrate and a cover. A frame with a first conductive layer is disposed on one side of the substrate; an audio sensing device and an integrated circuit (IC) device are disposed inside the frame; the audio sensing device is used to sense an audio signal and convert the audio signal into an electronic signal; the IC device performs impedance matching or signal amplification on the electronic signal; a ground device is disposed on the substrate; the IC device is covered with a non-conductive layer; a second conductive layer is disposed between the ground device and the first conductive layer to form an electrically conducting state; the cover is dispose on the frame of the substrate. Therefore, the non-conductive layer can prevent the IC device from being corrosive due to the effect of moisture, and the first and second conductive layers can be bundled with the ground device to provide the protection against electrical interference signal, thereby preventing the IC device from being interfered by electrical interference signal, such as electromagnetic interference.
TW094141012A 2005-11-22 2005-11-22 Microelectromechanical microphone and package method thereof TW200721872A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094141012A TW200721872A (en) 2005-11-22 2005-11-22 Microelectromechanical microphone and package method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094141012A TW200721872A (en) 2005-11-22 2005-11-22 Microelectromechanical microphone and package method thereof

Publications (2)

Publication Number Publication Date
TW200721872A true TW200721872A (en) 2007-06-01
TWI299961B TWI299961B (en) 2008-08-11

Family

ID=45069839

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141012A TW200721872A (en) 2005-11-22 2005-11-22 Microelectromechanical microphone and package method thereof

Country Status (1)

Country Link
TW (1) TW200721872A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101325823B (en) * 2007-06-11 2011-08-17 美律实业股份有限公司 Encapsulation construction for silicon crystal microphone
CN113853802A (en) * 2019-05-23 2021-12-28 星电株式会社 Substrate and microphone unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573469B (en) * 2012-02-22 2017-03-01 美律實業股份有限公司 Mems microphone module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101325823B (en) * 2007-06-11 2011-08-17 美律实业股份有限公司 Encapsulation construction for silicon crystal microphone
CN113853802A (en) * 2019-05-23 2021-12-28 星电株式会社 Substrate and microphone unit

Also Published As

Publication number Publication date
TWI299961B (en) 2008-08-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees