TW200721525A - Package structure of combining zener diode chip and light-emitting diode chip - Google Patents

Package structure of combining zener diode chip and light-emitting diode chip

Info

Publication number
TW200721525A
TW200721525A TW094140253A TW94140253A TW200721525A TW 200721525 A TW200721525 A TW 200721525A TW 094140253 A TW094140253 A TW 094140253A TW 94140253 A TW94140253 A TW 94140253A TW 200721525 A TW200721525 A TW 200721525A
Authority
TW
Taiwan
Prior art keywords
diode chip
light
emitting
package structure
combining
Prior art date
Application number
TW094140253A
Other languages
Chinese (zh)
Inventor
Cheng Lin
Masami Nei
Original Assignee
High Power Lighting Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by High Power Lighting Corp filed Critical High Power Lighting Corp
Priority to TW094140253A priority Critical patent/TW200721525A/en
Publication of TW200721525A publication Critical patent/TW200721525A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body

Landscapes

  • Led Devices (AREA)

Abstract

The invention provides a package structure of combining a zener diode chip and a light-emitting diode chip for rising reverse withstanding voltage and antistatic capability of a light-emitting-diode chip. There are pre-positioned, indented grooves with an adequate depth from the upper surface to the inside of the substrate formed on the substrate of the package structure. The light-emitting-diode chip and the zener diode chip are separately fixed on upper surface of the substrate and inside the grooves. Light emitted outward from the light-emitting-diode chip is not blocked by the zener diode chip, such that the invention provides a light-emitting-diode chip package with high antistatic capability and high light-emitting efficiency.
TW094140253A 2005-11-16 2005-11-16 Package structure of combining zener diode chip and light-emitting diode chip TW200721525A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094140253A TW200721525A (en) 2005-11-16 2005-11-16 Package structure of combining zener diode chip and light-emitting diode chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094140253A TW200721525A (en) 2005-11-16 2005-11-16 Package structure of combining zener diode chip and light-emitting diode chip

Publications (1)

Publication Number Publication Date
TW200721525A true TW200721525A (en) 2007-06-01

Family

ID=57912093

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094140253A TW200721525A (en) 2005-11-16 2005-11-16 Package structure of combining zener diode chip and light-emitting diode chip

Country Status (1)

Country Link
TW (1) TW200721525A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7994518B2 (en) 2007-12-11 2011-08-09 Foxsemicon Integrated Technology, Inc. Light-emitting diode
WO2012058834A1 (en) * 2010-11-05 2012-05-10 深圳市华星光电技术有限公司 Light emitting diode package structure
TWI449223B (en) * 2010-11-02 2014-08-11 Hon Hai Prec Ind Co Ltd Light emitting diode lead frame
CN104752369A (en) * 2013-12-27 2015-07-01 展晶科技(深圳)有限公司 Photoelectric element module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7994518B2 (en) 2007-12-11 2011-08-09 Foxsemicon Integrated Technology, Inc. Light-emitting diode
TWI449223B (en) * 2010-11-02 2014-08-11 Hon Hai Prec Ind Co Ltd Light emitting diode lead frame
WO2012058834A1 (en) * 2010-11-05 2012-05-10 深圳市华星光电技术有限公司 Light emitting diode package structure
CN104752369A (en) * 2013-12-27 2015-07-01 展晶科技(深圳)有限公司 Photoelectric element module
US9324702B2 (en) 2013-12-27 2016-04-26 Advanced Optoelectronic Technology, Inc. Photoelectric device
CN104752369B (en) * 2013-12-27 2018-02-16 展晶科技(深圳)有限公司 Photoelectric cell module

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