TW200721367A - Method of minimal wafer support on bevel edge of wafer - Google Patents

Method of minimal wafer support on bevel edge of wafer

Info

Publication number
TW200721367A
TW200721367A TW095127371A TW95127371A TW200721367A TW 200721367 A TW200721367 A TW 200721367A TW 095127371 A TW095127371 A TW 095127371A TW 95127371 A TW95127371 A TW 95127371A TW 200721367 A TW200721367 A TW 200721367A
Authority
TW
Taiwan
Prior art keywords
wafer
bodies
frame
bevel edge
support
Prior art date
Application number
TW095127371A
Other languages
Chinese (zh)
Inventor
Victor Mimken
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200721367A publication Critical patent/TW200721367A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Abstract

The present invention generally provides a method and apparatus for supporting and transferring a substrate in and out a wet cleaming chamber with minimal contact. One embodiment of the present invention provides an apparatus for support and transferring a substrate. The apparatus comprises a frame connected with an actuator configured to move the frame, two posts extending from the frame, two end effecter bodies, each of the two end effecter bodies formed on a respective one of the two posts, wherein the frame and the end effecter bodies are positioned on opposite ends of the two posts, and two contact assemblies extending from each of the two end effecter bodies, wherein the two contact assemblies are configured to receive and support the substrate near a bevel edge.
TW095127371A 2005-07-26 2006-07-26 Method of minimal wafer support on bevel edge of wafer TW200721367A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70290105P 2005-07-26 2005-07-26

Publications (1)

Publication Number Publication Date
TW200721367A true TW200721367A (en) 2007-06-01

Family

ID=37683967

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127371A TW200721367A (en) 2005-07-26 2006-07-26 Method of minimal wafer support on bevel edge of wafer

Country Status (4)

Country Link
EP (1) EP1913632A2 (en)
KR (1) KR20080031465A (en)
TW (1) TW200721367A (en)
WO (1) WO2007014289A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI632957B (en) * 2013-07-01 2018-08-21 應用材料股份有限公司 Apparatus for rinsing and drying substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9984867B2 (en) 2014-12-19 2018-05-29 Applied Materials, Inc. Systems and methods for rinsing and drying substrates

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6726848B2 (en) 2001-12-07 2004-04-27 Scp Global Technologies, Inc. Apparatus and method for single substrate processing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI632957B (en) * 2013-07-01 2018-08-21 應用材料股份有限公司 Apparatus for rinsing and drying substrate
US10672628B2 (en) 2013-07-01 2020-06-02 Applied Materials, Inc. Single use rinse in a linear Marangoni drier

Also Published As

Publication number Publication date
WO2007014289A3 (en) 2007-09-07
WO2007014289A2 (en) 2007-02-01
EP1913632A2 (en) 2008-04-23
KR20080031465A (en) 2008-04-08

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