TW200720892A - Heat dissipating module - Google Patents

Heat dissipating module

Info

Publication number
TW200720892A
TW200720892A TW094140295A TW94140295A TW200720892A TW 200720892 A TW200720892 A TW 200720892A TW 094140295 A TW094140295 A TW 094140295A TW 94140295 A TW94140295 A TW 94140295A TW 200720892 A TW200720892 A TW 200720892A
Authority
TW
Taiwan
Prior art keywords
fan
heat dissipating
heat
dissipating board
dissipating module
Prior art date
Application number
TW094140295A
Other languages
Chinese (zh)
Other versions
TWI287701B (en
Inventor
Yi-Lun Cheng
Chun-Lung Lin
Frank Wang
Original Assignee
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Corp filed Critical Inventec Corp
Priority to TW94140295A priority Critical patent/TWI287701B/en
Publication of TW200720892A publication Critical patent/TW200720892A/en
Application granted granted Critical
Publication of TWI287701B publication Critical patent/TWI287701B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention is to provide a heat dissipating module consisting of a fan and a heat dissipating board. The one-piece fan may reduce the manufacturing time needed, and the plastic fan may reduce the weight. With the hook design of the fan and the ear design of the heat dissipating board, the number of screws needed may be reduced; in addition, a screw is provided penetrating the first protrusion of the heat dissipating board and the second protrusion of the fan. By the heat dissipating board extending to the heat source and covering the fan, the heat on the motherboard may be conducted to the fan for removal.
TW94140295A 2005-11-16 2005-11-16 Heat dissipating module TWI287701B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94140295A TWI287701B (en) 2005-11-16 2005-11-16 Heat dissipating module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94140295A TWI287701B (en) 2005-11-16 2005-11-16 Heat dissipating module

Publications (2)

Publication Number Publication Date
TW200720892A true TW200720892A (en) 2007-06-01
TWI287701B TWI287701B (en) 2007-10-01

Family

ID=39201744

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94140295A TWI287701B (en) 2005-11-16 2005-11-16 Heat dissipating module

Country Status (1)

Country Link
TW (1) TWI287701B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113068371A (en) * 2021-02-04 2021-07-02 安徽江淮朗格电气有限公司 Four-axis servo driver heat abstractor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113068371A (en) * 2021-02-04 2021-07-02 安徽江淮朗格电气有限公司 Four-axis servo driver heat abstractor
CN113068371B (en) * 2021-02-04 2024-03-26 安徽朗格电气股份有限公司 Four-axis servo driver heat abstractor

Also Published As

Publication number Publication date
TWI287701B (en) 2007-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees