TW200717860A - Embedding heat-dissipating structure of light emitting diode package and method of fabricating the same - Google Patents

Embedding heat-dissipating structure of light emitting diode package and method of fabricating the same

Info

Publication number
TW200717860A
TW200717860A TW094138095A TW94138095A TW200717860A TW 200717860 A TW200717860 A TW 200717860A TW 094138095 A TW094138095 A TW 094138095A TW 94138095 A TW94138095 A TW 94138095A TW 200717860 A TW200717860 A TW 200717860A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting diode
heat conductive
heat
fabricating
Prior art date
Application number
TW094138095A
Other languages
Chinese (zh)
Inventor
Zong-Ding Sun
Hung-Ta Liao
Tz-Shiuan Yan
Po-Jen Su
Original Assignee
Edison Opto Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Edison Opto Corp filed Critical Edison Opto Corp
Priority to TW094138095A priority Critical patent/TW200717860A/en
Publication of TW200717860A publication Critical patent/TW200717860A/en

Links

Landscapes

  • Led Device Packages (AREA)

Abstract

The present invention provides an embedding heat-dissipating structure of light emitting diode package with a heat conductive pillar and method of fabricating the same. The structure comprises a substrate, a heat conductive pillar and a light emitting diode die, wherein the heat conductive pillar is embedded directly to and through the circuit board. One face of the heat conductive pillar is connected to the light emitting diode de to form a heat conductive end . Accordingly, the heat generated by the light emitting diode is guided directly to outside of the package structure via the heat conductive pillar, so as to achieve the best heat-dissipating effect.
TW094138095A 2005-10-31 2005-10-31 Embedding heat-dissipating structure of light emitting diode package and method of fabricating the same TW200717860A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094138095A TW200717860A (en) 2005-10-31 2005-10-31 Embedding heat-dissipating structure of light emitting diode package and method of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094138095A TW200717860A (en) 2005-10-31 2005-10-31 Embedding heat-dissipating structure of light emitting diode package and method of fabricating the same

Publications (1)

Publication Number Publication Date
TW200717860A true TW200717860A (en) 2007-05-01

Family

ID=57911778

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094138095A TW200717860A (en) 2005-10-31 2005-10-31 Embedding heat-dissipating structure of light emitting diode package and method of fabricating the same

Country Status (1)

Country Link
TW (1) TW200717860A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2012244393B1 (en) * 2012-11-07 2013-10-10 Chao-Chin Yeh LED Cooling Structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2012244393B1 (en) * 2012-11-07 2013-10-10 Chao-Chin Yeh LED Cooling Structure

Similar Documents

Publication Publication Date Title
TW200637031A (en) Compact light emitting device package with enhanced heat dissipation and method for making the package
NZ590716A (en) Led module
TW200610160A (en) Light emitting diode package and its packaging method
TW200733436A (en) Light emitting diode package structure and fabrication method thereof
TW200739935A (en) Semiconductor light emitting device and method of fabricating the same
TW200735425A (en) Light-emitting diode package and manufacturing method thereof
TW200709475A (en) Light emitting diode package and method for making same
ATE470877T1 (en) LIGHTING STRUCTURE WITH AT LEAST ONE LIGHT-LIGHT DIODE, ITS PRODUCTION AND ITS APPLICATIONS
TW200802975A (en) Light emitting diode package having anodized insulation layer and fabrication method therefor
EP2327582A3 (en) LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
EP2455991A4 (en) Led chip assembly, led package, and manufacturing method of led package
TW200721547A (en) Light emitting diode and method for manufacturing the same
CL2010000705A1 (en) Luminescent device based on a luminescent diode (LED), which includes a base with a stop, a LED module mounted on the base connection section, and at least one control circuit coupled within the base and an electrical connection with the led module
TW200746474A (en) Semiconductor device and semiconductor device fabrication method
EP2038924A4 (en) Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method
EP2315264A4 (en) Light-emitting device
EP2413392A4 (en) Light-emitting diode package
TW200951359A (en) LED lamp module and its fabricating method
WO2008120606A1 (en) Semiconductor light emitting device
TW200636943A (en) Optical device cavity structure, optical device, and method for manufacturing an optical device cavity structure
TW200729555A (en) Light emitting apparatus, semiconductor apparatus and the making method
TW200735334A (en) Photo-diode with integrated semiconductor circuit and method for its production
WO2009002129A3 (en) Semiconductor light emitting device and method of manufacturing the same
TW200802934A (en) Light emitting diode and method manufacturing the same
WO2010024635A3 (en) Light emitting device package