TW200717758A - Chip-on-glass sensor package for preventing its sensor region from contamination of outgassing during curing an encapsulant and method for fabricating the same - Google Patents
Chip-on-glass sensor package for preventing its sensor region from contamination of outgassing during curing an encapsulant and method for fabricating the sameInfo
- Publication number
- TW200717758A TW200717758A TW094138164A TW94138164A TW200717758A TW 200717758 A TW200717758 A TW 200717758A TW 094138164 A TW094138164 A TW 094138164A TW 94138164 A TW94138164 A TW 94138164A TW 200717758 A TW200717758 A TW 200717758A
- Authority
- TW
- Taiwan
- Prior art keywords
- chip
- encapsulant
- contamination
- preventing
- sensor region
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Gyroscopes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094138164A TWI307148B (en) | 2005-10-31 | 2005-10-31 | Chip-on-glass sensor package for preventing its sensor region from contamination of outgassing during curing an encapsulant and method for fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094138164A TWI307148B (en) | 2005-10-31 | 2005-10-31 | Chip-on-glass sensor package for preventing its sensor region from contamination of outgassing during curing an encapsulant and method for fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200717758A true TW200717758A (en) | 2007-05-01 |
TWI307148B TWI307148B (en) | 2009-03-01 |
Family
ID=45071548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094138164A TWI307148B (en) | 2005-10-31 | 2005-10-31 | Chip-on-glass sensor package for preventing its sensor region from contamination of outgassing during curing an encapsulant and method for fabricating the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI307148B (zh) |
-
2005
- 2005-10-31 TW TW094138164A patent/TWI307148B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI307148B (en) | 2009-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |