TW200715588A - A hybridization packaging structure and method of LED chip and multiplexer/ driver chip for LED printer head - Google Patents
A hybridization packaging structure and method of LED chip and multiplexer/ driver chip for LED printer headInfo
- Publication number
- TW200715588A TW200715588A TW094135393A TW94135393A TW200715588A TW 200715588 A TW200715588 A TW 200715588A TW 094135393 A TW094135393 A TW 094135393A TW 94135393 A TW94135393 A TW 94135393A TW 200715588 A TW200715588 A TW 200715588A
- Authority
- TW
- Taiwan
- Prior art keywords
- led
- multiplexer
- chip
- trench
- led chip
- Prior art date
Links
Landscapes
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Abstract
A hybridization packaging structure and method of LED chip and multiplexer/driver chip for LED printer head is provided. In order to connect the LED-multiplexer module to the LED chip without wire bonding, a multiplexer chip, made of silicon material, has multiplexer circuit on one side and a U-shape trench on the other side, the depth of the trench is the same as that of the LED chip. In one side of the trench, there is a plurality of positioning pin. Another linear array LED chip, made of non-silicon material, has a plurality positioning well corresponding to the positioning pin of the trench. Push the LED chip along the U-shape trench to its predetermine position, then by tilling the U-shape trench so that the positioning well of the LED chip will slip into the positioning pin of the trench, thus the pads of the LED will in its corresponding position with the pads on the multiplexer circuit. Finally, connect pads of the LED to their corresponding pads on the multiplexer with bump copper plating. There is a transparent epoxy micro-lens on each LED device to give better focus and increase the depth of field.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW94135393A TWI256143B (en) | 2005-10-11 | 2005-10-11 | A hybridization packaging structure and method of led chip and multiplexer/driver chip for led printer head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW94135393A TWI256143B (en) | 2005-10-11 | 2005-10-11 | A hybridization packaging structure and method of led chip and multiplexer/driver chip for led printer head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI256143B TWI256143B (en) | 2006-06-01 |
| TW200715588A true TW200715588A (en) | 2007-04-16 |
Family
ID=37614090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW94135393A TWI256143B (en) | 2005-10-11 | 2005-10-11 | A hybridization packaging structure and method of led chip and multiplexer/driver chip for led printer head |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI256143B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI407605B (en) * | 2010-11-15 | 2013-09-01 | Advanced Optoelectronic Tech | Light-emitting diode package |
| CN103561958A (en) * | 2011-05-31 | 2014-02-05 | 惠普发展公司，有限责任合伙企业 | Printhead die |
-
2005
- 2005-10-11 TW TW94135393A patent/TWI256143B/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI407605B (en) * | 2010-11-15 | 2013-09-01 | Advanced Optoelectronic Tech | Light-emitting diode package |
| CN103561958A (en) * | 2011-05-31 | 2014-02-05 | 惠普发展公司，有限责任合伙企业 | Printhead die |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI256143B (en) | 2006-06-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200633508A (en) | Semiconductor image sensor module, manufacturing method of semiconductor image sensor module, camera and manufacturing method of camera | |
| ATE546836T1 (en) | USE OF A TRANSPARENT LED DISPLAY DEVICE IN A MOTOR VEHICLE | |
| TW200610191A (en) | Semiconductor light emitting device with flexible substrate | |
| TW200737536A (en) | Bendable solid state planar light source, a flexible substrate therefor, and a manufacturing method therewith | |
| WO2005122249A3 (en) | Semiconductor device module with flip chip devices on a common lead frame | |
| SG151204A1 (en) | Integrated circuit package system with leadframe array | |
| TW200520123A (en) | Method for mounting semiconductor chip and semiconductor chip-mounted board | |
| TW200802767A (en) | A flip-chip package structure with stiffener | |
| TW200721400A (en) | Cavity chip package | |
| TW200709378A (en) | Chip package structure | |
| EP2104142A3 (en) | Semiconductor chip package | |
| WO2010051211A3 (en) | Pre-molded, clip-bonded multi-die semiconductor package | |
| HK1103166A1 (en) | Encapsulated chip scale package having flip-chip on lead frame structure and method | |
| TW200631136A (en) | Method and device for heat dissipation in semiconductor modules | |
| WO2009028612A1 (en) | Light emitting device | |
| EP2752873A3 (en) | Semiconductor module | |
| TW200627555A (en) | Method for wafer level package | |
| TW200735293A (en) | Semiconductor device, substrate and manufacturing method thereof | |
| WO2012116157A3 (en) | Chip module embedded in pcb substrate | |
| TW200715588A (en) | A hybridization packaging structure and method of LED chip and multiplexer/ driver chip for LED printer head | |
| TW200629501A (en) | Chip scale packaging with improved heat dissipation capability | |
| TW200644207A (en) | Semiconductor device chip and semiconductor device chip package | |
| MY119889A (en) | Planarized plastic package modules for integrated circuits | |
| TW200623445A (en) | A LED array package structure and method thereof | |
| WO2008091919A3 (en) | Thermally enhanced single in-line package (sip) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |