TW200714414A - Polishing pad and method for manufacturing polishing pads - Google Patents

Polishing pad and method for manufacturing polishing pads

Info

Publication number
TW200714414A
TW200714414A TW095131394A TW95131394A TW200714414A TW 200714414 A TW200714414 A TW 200714414A TW 095131394 A TW095131394 A TW 095131394A TW 95131394 A TW95131394 A TW 95131394A TW 200714414 A TW200714414 A TW 200714414A
Authority
TW
Taiwan
Prior art keywords
particles
polymer
polishing pad
polishing
manufacturing
Prior art date
Application number
TW095131394A
Other languages
Chinese (zh)
Inventor
Clifford O Thomson
Scott B Daskicwich
Jeffrey C Doyle
Original Assignee
Jh Rhodes Company Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jh Rhodes Company Inc filed Critical Jh Rhodes Company Inc
Publication of TW200714414A publication Critical patent/TW200714414A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

A polishing pad comprising particles having an average diameter between 1 nanometer and 100 nanometers, wherein the total weight of the particles is greater than about 3% of the total weight of the pad. Also, a method of manufacturing a polishing pad comprises the steps of: mixing a pre-polymer and abrasive particles together; wherein the abrasive particles have an average diameter of between 1 nanometer and 100 nanometers in diameter, and wherein the abrasive particles comprise more than about 3% by weight of the polishing pad; mixing a curative with the mixed pre-polymer and particles; and pouring the mixture of pre-polymer, particles and curative into a mold. In one exemplary embodiment the particles are silica and the pre-polymer is a polyurethane pre-polymer.
TW095131394A 2005-08-26 2006-08-25 Polishing pad and method for manufacturing polishing pads TW200714414A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/162,068 US20070049164A1 (en) 2005-08-26 2005-08-26 Polishing pad and method for manufacturing polishing pads

Publications (1)

Publication Number Publication Date
TW200714414A true TW200714414A (en) 2007-04-16

Family

ID=37603084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131394A TW200714414A (en) 2005-08-26 2006-08-25 Polishing pad and method for manufacturing polishing pads

Country Status (3)

Country Link
US (1) US20070049164A1 (en)
TW (1) TW200714414A (en)
WO (1) WO2007025226A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112045557A (en) * 2015-10-16 2020-12-08 应用材料公司 Method and apparatus for forming advanced polishing pads using additive manufacturing processes
CN114196327A (en) * 2022-01-28 2022-03-18 淄博海泰新光光学技术有限公司 Composite material for polishing optical parts and preparation method thereof
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11958162B2 (en) 2014-10-17 2024-04-16 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
KR100881162B1 (en) * 2008-03-28 2009-02-03 주식회사 세라코리 Method for manufacturing a conditioning disc for polishing pad
DE102009030297B3 (en) * 2009-06-24 2011-01-20 Siltronic Ag Method for polishing a semiconductor wafer
US8257152B2 (en) * 2010-11-12 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Silicate composite polishing pad
EP2997104A4 (en) * 2013-05-15 2017-01-25 Basf Se Use of a chemical-mechanical polishing (cmp) composition for polishing a substrate or layer containing at least one iii-v material
WO2015095154A1 (en) * 2013-12-20 2015-06-25 Cabot Corporation Metal oxide-polymer composite particles for chemical mechanical planarization
US10029346B2 (en) 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100487455B1 (en) * 1997-01-13 2005-05-09 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 Polymeric Polishing Pad Having Photolithographically Induced Surface Pattern(s) and Methods Relating Thereto
US6187824B1 (en) * 1999-08-25 2001-02-13 Nyacol Nano Technologies, Inc. Zinc oxide sol and method of making
KR100726303B1 (en) * 2000-05-31 2007-06-13 제이에스알 가부시끼가이샤 Abrasive Material
JP4177100B2 (en) * 2000-12-01 2008-11-05 東洋ゴム工業株式会社 Polishing pad, method for producing the same, and cushion layer for polishing pad
US6537665B2 (en) * 2001-04-11 2003-03-25 Nyacol Nano Technologies, Inc. Nano-sized dispersible powders and method of making
CN1268695C (en) * 2001-09-11 2006-08-09 3M创新有限公司 Smudge resistant nanocomposite hardcoats and methods for making same
US6893476B2 (en) * 2002-12-09 2005-05-17 Dupont Air Products Nanomaterials Llc Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal
WO2004053456A2 (en) * 2002-12-09 2004-06-24 Corning Incorporated Method using multi-component colloidal abrasives for cmp processing of semiconductor and optical materials
US6910951B2 (en) * 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
DE602006010822D1 (en) * 2005-01-28 2010-01-14 Saint Gobain Abrasives Inc GRINDING AND MANUFACTURING METHOD THEREFOR

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11446788B2 (en) 2014-10-17 2022-09-20 Applied Materials, Inc. Precursor formulations for polishing pads produced by an additive manufacturing process
US11724362B2 (en) 2014-10-17 2023-08-15 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US11958162B2 (en) 2014-10-17 2024-04-16 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
CN112045557A (en) * 2015-10-16 2020-12-08 应用材料公司 Method and apparatus for forming advanced polishing pads using additive manufacturing processes
US11772229B2 (en) 2016-01-19 2023-10-03 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN114196327A (en) * 2022-01-28 2022-03-18 淄博海泰新光光学技术有限公司 Composite material for polishing optical parts and preparation method thereof

Also Published As

Publication number Publication date
US20070049164A1 (en) 2007-03-01
WO2007025226A1 (en) 2007-03-01

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