TW200714190A - Thermal module - Google Patents

Thermal module

Info

Publication number
TW200714190A
TW200714190A TW094133044A TW94133044A TW200714190A TW 200714190 A TW200714190 A TW 200714190A TW 094133044 A TW094133044 A TW 094133044A TW 94133044 A TW94133044 A TW 94133044A TW 200714190 A TW200714190 A TW 200714190A
Authority
TW
Taiwan
Prior art keywords
group
thermal module
fin
main body
plate
Prior art date
Application number
TW094133044A
Other languages
Chinese (zh)
Other versions
TWI267346B (en
Inventor
Ching-Bai Hwang
Jing-Gong Meng
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94133044A priority Critical patent/TWI267346B/en
Application granted granted Critical
Publication of TWI267346B publication Critical patent/TWI267346B/en
Publication of TW200714190A publication Critical patent/TW200714190A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A thermal module includes a plate, and at least a group of fins mounted on the plate. Each fin of the group includes a main body. The main body of at least a fin of the group forms a sharp angle with an arrangement direction of the group, for increasing heat dissipating areas of the group of fins.
TW94133044A 2005-09-23 2005-09-23 Thermal module TWI267346B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94133044A TWI267346B (en) 2005-09-23 2005-09-23 Thermal module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94133044A TWI267346B (en) 2005-09-23 2005-09-23 Thermal module

Publications (2)

Publication Number Publication Date
TWI267346B TWI267346B (en) 2006-11-21
TW200714190A true TW200714190A (en) 2007-04-01

Family

ID=38191837

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94133044A TWI267346B (en) 2005-09-23 2005-09-23 Thermal module

Country Status (1)

Country Link
TW (1) TWI267346B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9665139B2 (en) 2012-08-27 2017-05-30 Razer (Asia-Pacific) Pte. Ltd. Cooling system for a computer and method for assembling the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI505073B (en) 2012-03-22 2015-10-21 Compal Electronics Inc Electronic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9665139B2 (en) 2012-08-27 2017-05-30 Razer (Asia-Pacific) Pte. Ltd. Cooling system for a computer and method for assembling the same
TWI621940B (en) * 2012-08-27 2018-04-21 新加坡商雷蛇（亞太）私人有限公司 Computer systems, parts of a housing for a computer system, and methods for assembling parts of a computer system

Also Published As

Publication number Publication date
TWI267346B (en) 2006-11-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees