TW200714158A - Bonding method - Google Patents

Bonding method

Info

Publication number
TW200714158A
TW200714158A TW095129304A TW95129304A TW200714158A TW 200714158 A TW200714158 A TW 200714158A TW 095129304 A TW095129304 A TW 095129304A TW 95129304 A TW95129304 A TW 95129304A TW 200714158 A TW200714158 A TW 200714158A
Authority
TW
Taiwan
Prior art keywords
array wiring
metal electrode
laser beam
contact
state
Prior art date
Application number
TW095129304A
Other languages
Chinese (zh)
Inventor
Eisaku Kojima
Takehiko Wada
Tetsuya Uno
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Publication of TW200714158A publication Critical patent/TW200714158A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)

Abstract

A bonding method is provided by which the assembly in high speed and high precision is realized without the use of bonding materials of ACF etc. film. The bump of TCP and the array wiring is holded in the approaching or contacting state. The laser beam is irradiated on the array wiring. At this moment, the laser beam is irradiated until the array wiring exceeds the melting temperature. In this way, the metal electrode of the array wiring is heated by the energy from the laser beam so that the surface adjacent the metal electrode of the array wiring is melted to cause the contact with the metal electrode of upper side. In the state of contact, the metal atoms forming each metal electrode shift to the metal electrode in contact state so that the so called atomic diffusion phenomena is formed thereby. In the formation of the atomic diffusion phenomena, the metal atoms form mixed alloy with each other so that the bump of TCP and the array wiring is bonded together.
TW095129304A 2005-08-11 2006-08-10 Bonding method TW200714158A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005233586A JP2007049040A (en) 2005-08-11 2005-08-11 Joining method

Publications (1)

Publication Number Publication Date
TW200714158A true TW200714158A (en) 2007-04-01

Family

ID=37721664

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129304A TW200714158A (en) 2005-08-11 2006-08-10 Bonding method

Country Status (3)

Country Link
JP (1) JP2007049040A (en)
CN (1) CN1912694A (en)
TW (1) TW200714158A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12069811B2 (en) 2022-02-10 2024-08-20 AUO Corporation Bonding apparatus

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101442881B (en) * 2007-11-21 2010-09-22 达航工业股份有限公司 Method for joining electrode
JP5939184B2 (en) * 2013-03-22 2016-06-22 ソニー株式会社 Manufacturing method of semiconductor device
US11094862B2 (en) 2018-06-13 2021-08-17 Prilit Optronics, Inc. Semiconductor device with through holes on bonding parts and bonding method thereof
JP2020035960A (en) * 2018-08-31 2020-03-05 株式会社ジェイテクト Joint device and joint manufacturing method
CN114578595A (en) * 2022-03-11 2022-06-03 Tcl华星光电技术有限公司 Liquid crystal display panel and display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12069811B2 (en) 2022-02-10 2024-08-20 AUO Corporation Bonding apparatus

Also Published As

Publication number Publication date
CN1912694A (en) 2007-02-14
JP2007049040A (en) 2007-02-22

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