TW200713616A - Semiconductor package and its manufacturing method - Google Patents

Semiconductor package and its manufacturing method

Info

Publication number
TW200713616A
TW200713616A TW094133230A TW94133230A TW200713616A TW 200713616 A TW200713616 A TW 200713616A TW 094133230 A TW094133230 A TW 094133230A TW 94133230 A TW94133230 A TW 94133230A TW 200713616 A TW200713616 A TW 200713616A
Authority
TW
Taiwan
Prior art keywords
substrate
underfill
bumped chip
pillar bumps
semiconductor package
Prior art date
Application number
TW094133230A
Other languages
Chinese (zh)
Other versions
TWI301674B (en
Inventor
Chih-Wen Ho
Original Assignee
Int Semiconductor Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Int Semiconductor Tech Ltd filed Critical Int Semiconductor Tech Ltd
Priority to TW94133230A priority Critical patent/TWI301674B/en
Publication of TW200713616A publication Critical patent/TW200713616A/en
Application granted granted Critical
Publication of TWI301674B publication Critical patent/TWI301674B/en

Links

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  • Wire Bonding (AREA)

Abstract

A semiconductor package mainly includes a substrate, a bumped chip and an underfill. A plurality of pillar bumps of the bumped chip are thermocompressed to a plurality of connecting pads of the substrate, and the underfill is formed between the bumped chip and the substrate. At least a top surface of the pillar bumps has a curved or oblique edge, which is closed to a side of an active surface of the bumped chip. By means of sidewalls connecting the curved or oblique side of the pillar bumps, it can prevent bubbles of the underfill to be accumulated on the sidewall of the pillar bumps while the underfill flows between the substrate and the bumped chip to improve reliability.
TW94133230A 2005-09-23 2005-09-23 Semiconductor package and its manufacturing method TWI301674B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94133230A TWI301674B (en) 2005-09-23 2005-09-23 Semiconductor package and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94133230A TWI301674B (en) 2005-09-23 2005-09-23 Semiconductor package and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200713616A true TW200713616A (en) 2007-04-01
TWI301674B TWI301674B (en) 2008-10-01

Family

ID=45070298

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94133230A TWI301674B (en) 2005-09-23 2005-09-23 Semiconductor package and its manufacturing method

Country Status (1)

Country Link
TW (1) TWI301674B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI559583B (en) * 2011-06-15 2016-11-21 Daishinku Corp Electronic components for the package and piezoelectric vibration components
TWI604537B (en) * 2016-09-30 2017-11-01 南亞科技股份有限公司 Semiconductor package and method for forming the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI559583B (en) * 2011-06-15 2016-11-21 Daishinku Corp Electronic components for the package and piezoelectric vibration components
TWI604537B (en) * 2016-09-30 2017-11-01 南亞科技股份有限公司 Semiconductor package and method for forming the same

Also Published As

Publication number Publication date
TWI301674B (en) 2008-10-01

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