TW200712702A - Method of forming masking film having partition pattern - Google Patents

Method of forming masking film having partition pattern

Info

Publication number
TW200712702A
TW200712702A TW095104425A TW95104425A TW200712702A TW 200712702 A TW200712702 A TW 200712702A TW 095104425 A TW095104425 A TW 095104425A TW 95104425 A TW95104425 A TW 95104425A TW 200712702 A TW200712702 A TW 200712702A
Authority
TW
Taiwan
Prior art keywords
sheet
partition pattern
masking
bonded
adhesive
Prior art date
Application number
TW095104425A
Other languages
Chinese (zh)
Inventor
Masafumi Mogi
Masakazu Nakamura
Sho Katanahara
Original Assignee
Alps Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Engineering Co Ltd filed Critical Alps Engineering Co Ltd
Publication of TW200712702A publication Critical patent/TW200712702A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern

Abstract

To provide a method of forming a masking film applicable to both of blasting and etching. The method comprises: a step (A) in which a PVC sheet (1) disposed on a release paper (2) is partly cut out so as to leave given partition pattern formation parts (11), with the release paper left on the back side; a step (B1) in which a low-tack application sheet (3) is pressed-bonded to the front side of the masking sheet (1) which has been cut so as to have the partition pattern formation parts (11); a step (B2) in which the release paper (2) is stripped from the three-layered sheet material having the application sheet (3) on one side; a step (C) in which an adhesive (5) is applied to the masking sheet (1); a step (D) in which the masking sheet (1) coated with the adhesive (5) is press-bonded to a surface of a panel (7) through the adhesive (5); and a step (E) in which the application sheet (3) is stripped from the masking sheet (1) in the state of being press-bonded to the panel (7) surface.
TW095104425A 2005-09-20 2006-02-09 Method of forming masking film having partition pattern TW200712702A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005271409A JP2007087615A (en) 2005-09-20 2005-09-20 Method of manufacturing masking film with barrier-rib pattern

Publications (1)

Publication Number Publication Date
TW200712702A true TW200712702A (en) 2007-04-01

Family

ID=37888638

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104425A TW200712702A (en) 2005-09-20 2006-02-09 Method of forming masking film having partition pattern

Country Status (3)

Country Link
JP (1) JP2007087615A (en)
TW (1) TW200712702A (en)
WO (1) WO2007034579A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4698532B2 (en) * 2006-09-01 2011-06-08 株式会社アルプスエンジニアリング Method for forming masking film having partition pattern on panel surface and apparatus used therefor
JP7032106B2 (en) * 2017-11-01 2022-03-08 臼井国際産業株式会社 Label for sticking, label sticking method, torque sensor shaft manufacturing method and shaft manufacturing equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56134174A (en) * 1980-02-26 1981-10-20 Toppan Printing Co Ltd Masking of sand blasting treatment
JPS57121466A (en) * 1981-01-22 1982-07-28 Hiroshi Goto Protective transfer paper for sandblast
JPS5974057U (en) * 1982-07-08 1984-05-19 株式会社ノリタケカンパニーリミテド Pressure transfer paper for sandblasting
JPS61141553A (en) * 1984-12-14 1986-06-28 Fuji Seisakusho:Kk Sandblasting method and transferring material
JPS63312069A (en) * 1987-03-03 1988-12-20 Sakae Ikeda Forming method for pattern on stone material and pattern forming elementary plate used in this method
JP2001142401A (en) * 1999-08-27 2001-05-25 Masanori Minato Seal with pocket
JP2003204160A (en) * 2001-09-26 2003-07-18 Fujikura Ltd Interlayer connection structure of multilayer interconnection board, manufacturing method and land section formation method of flexible printed circuit board

Also Published As

Publication number Publication date
WO2007034579A1 (en) 2007-03-29
JP2007087615A (en) 2007-04-05

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