TW200712420A - The method and its realization for the assembly of heat dissipation fins and heat pipe - Google Patents

The method and its realization for the assembly of heat dissipation fins and heat pipe

Info

Publication number
TW200712420A
TW200712420A TW094130691A TW94130691A TW200712420A TW 200712420 A TW200712420 A TW 200712420A TW 094130691 A TW094130691 A TW 094130691A TW 94130691 A TW94130691 A TW 94130691A TW 200712420 A TW200712420 A TW 200712420A
Authority
TW
Taiwan
Prior art keywords
assembly
tin
heat pipe
heat
dissipation fins
Prior art date
Application number
TW094130691A
Other languages
Chinese (zh)
Other versions
TWI268338B (en
Inventor
xin-mao Xie
Original Assignee
Adda Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adda Corp filed Critical Adda Corp
Priority to TW094130691A priority Critical patent/TWI268338B/en
Application granted granted Critical
Publication of TWI268338B publication Critical patent/TWI268338B/en
Publication of TW200712420A publication Critical patent/TW200712420A/en

Links

Abstract

This invention related to the method and its realization for the assembly of heat dissipation fins and heat pipe. It comprises the process for the positioning of heat pipes, the process for the assembly of heat dissipation fins, the process for the setting of tin rings, repeat fin assembly and tin ring setting processes until desired number of fins set and the process for the melting of tin rings. The assembly process are simplified due to no extra through-holes needed on fins for tin strip passing and cost down resulted. Due to the design that tin ring sets around the heat pipe at place close to the through-hole on the fin, melted tin permeates into the round gap between the heat pipe and the fin. It brings a solid binding between them.
TW094130691A 2005-09-07 2005-09-07 The method and its realization for the assembly of heat dissipation fins and heat pipe this invention simplifies the assembly process and results cost down, it brings a solid binding due to melted tin permeates into the round gap between heat pipe and the fin TWI268338B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094130691A TWI268338B (en) 2005-09-07 2005-09-07 The method and its realization for the assembly of heat dissipation fins and heat pipe this invention simplifies the assembly process and results cost down, it brings a solid binding due to melted tin permeates into the round gap between heat pipe and the fin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094130691A TWI268338B (en) 2005-09-07 2005-09-07 The method and its realization for the assembly of heat dissipation fins and heat pipe this invention simplifies the assembly process and results cost down, it brings a solid binding due to melted tin permeates into the round gap between heat pipe and the fin

Publications (2)

Publication Number Publication Date
TWI268338B TWI268338B (en) 2006-12-11
TW200712420A true TW200712420A (en) 2007-04-01

Family

ID=57911285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130691A TWI268338B (en) 2005-09-07 2005-09-07 The method and its realization for the assembly of heat dissipation fins and heat pipe this invention simplifies the assembly process and results cost down, it brings a solid binding due to melted tin permeates into the round gap between heat pipe and the fin

Country Status (1)

Country Link
TW (1) TWI268338B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105101647A (en) * 2015-08-07 2015-11-25 深圳崇达多层线路板有限公司 Manufacturing method of heat dissipation PCB (printed circuit board)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105101647A (en) * 2015-08-07 2015-11-25 深圳崇达多层线路板有限公司 Manufacturing method of heat dissipation PCB (printed circuit board)

Also Published As

Publication number Publication date
TWI268338B (en) 2006-12-11

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