TW200710096A - Resin for electronic application and method of its preparation - Google Patents

Resin for electronic application and method of its preparation

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Publication number
TW200710096A
TW200710096A TW094130183A TW94130183A TW200710096A TW 200710096 A TW200710096 A TW 200710096A TW 094130183 A TW094130183 A TW 094130183A TW 94130183 A TW94130183 A TW 94130183A TW 200710096 A TW200710096 A TW 200710096A
Authority
TW
Taiwan
Prior art keywords
group
resin
hydrogen
electronic application
groups
Prior art date
Application number
TW094130183A
Other languages
Chinese (zh)
Other versions
TWI318980B (en
Inventor
Ching-Hsuan Lin
sheng-xiong Cai
Kai-Zhi Yang
Original Assignee
Univ Nat Chunghsing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Chunghsing filed Critical Univ Nat Chunghsing
Priority to TW094130183A priority Critical patent/TW200710096A/en
Publication of TW200710096A publication Critical patent/TW200710096A/en
Application granted granted Critical
Publication of TWI318980B publication Critical patent/TWI318980B/zh

Links

Abstract

This invention provides a resin for electronic application and the method of producing the same. The electronic resin of this invention is a phosphorus-containing flame resistant resin having the following formula: 094130183-p01.bmp where X is OC≡N or OCH2CH2OCH2, R is selected from the group containing hydrogen, C1-C6 alkyl groups, C1-C6 alkoxy groups, phenyl group, biphenyl group, halogen, nitro group, phenoxy group, C3-C7 clcloalkyl groups or a compound represented by the following formula: 094130183-p02.bmp where Y and N locate in an ortho, meta or para position of the benzene ring, Y is selected from the group consisting of hydrogen, C1-C6 alkyl group, C1-C6 alkoxy group, phenyl group, biphenyl group, halogen, nitro group, phenoxy group, C3-C7 cycloalkyl group, phenol group, amino group, or carboxyl group; Rm is hydrogen or C1-C4 alkyl groups. The method for producing the resin for electronic application of this invention is characterized by reacting dopotriol with a reactant having an appropriate functional group, such as halonitrile, epichlorohydrin or dioxydiethylene/methylamine.
TW094130183A 2005-09-02 2005-09-02 Resin for electronic application and method of its preparation TW200710096A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094130183A TW200710096A (en) 2005-09-02 2005-09-02 Resin for electronic application and method of its preparation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094130183A TW200710096A (en) 2005-09-02 2005-09-02 Resin for electronic application and method of its preparation

Publications (2)

Publication Number Publication Date
TW200710096A true TW200710096A (en) 2007-03-16
TWI318980B TWI318980B (en) 2010-01-01

Family

ID=45073571

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130183A TW200710096A (en) 2005-09-02 2005-09-02 Resin for electronic application and method of its preparation

Country Status (1)

Country Link
TW (1) TW200710096A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413644B (en) * 2008-01-15 2013-11-01 Nat Univ Chung Hsing Manufacture of phosphorus-containing diamines and their derivatives
TWI500627B (en) * 2009-06-30 2015-09-21 Nat Univ Chung Hsing Phenol-containing multifunctional epoxy curing agents and their derivatives, preparation and use

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI413644B (en) * 2008-01-15 2013-11-01 Nat Univ Chung Hsing Manufacture of phosphorus-containing diamines and their derivatives
TWI500627B (en) * 2009-06-30 2015-09-21 Nat Univ Chung Hsing Phenol-containing multifunctional epoxy curing agents and their derivatives, preparation and use

Also Published As

Publication number Publication date
TWI318980B (en) 2010-01-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees