TW200709527A - Thermal protection circuits, power delivery integrated circuits and power delivery methods - Google Patents

Thermal protection circuits, power delivery integrated circuits and power delivery methods

Info

Publication number
TW200709527A
TW200709527A TW095127183A TW95127183A TW200709527A TW 200709527 A TW200709527 A TW 200709527A TW 095127183 A TW095127183 A TW 095127183A TW 95127183 A TW95127183 A TW 95127183A TW 200709527 A TW200709527 A TW 200709527A
Authority
TW
Taiwan
Prior art keywords
power delivery
circuits
shutdown
thermal protection
restart
Prior art date
Application number
TW095127183A
Other languages
English (en)
Other versions
TWI392184B (zh
Inventor
zheng-wei Zhang
Original Assignee
Monolithic Power Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monolithic Power Systems Inc filed Critical Monolithic Power Systems Inc
Publication of TW200709527A publication Critical patent/TW200709527A/zh
Application granted granted Critical
Publication of TWI392184B publication Critical patent/TWI392184B/zh

Links

Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/00309Overheat or overtemperature protection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Protection Of Static Devices (AREA)
TW095127183A 2005-08-16 2006-07-25 熱保護電路、功率傳輸積體電路及功率傳輸方法 TWI392184B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/205,901 US7420792B2 (en) 2005-08-16 2005-08-16 Linear charger where the material temperature directly affects the circuit thermal control

Publications (2)

Publication Number Publication Date
TW200709527A true TW200709527A (en) 2007-03-01
TWI392184B TWI392184B (zh) 2013-04-01

Family

ID=37738236

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127183A TWI392184B (zh) 2005-08-16 2006-07-25 熱保護電路、功率傳輸積體電路及功率傳輸方法

Country Status (3)

Country Link
US (1) US7420792B2 (zh)
CN (1) CN1917321B (zh)
TW (1) TWI392184B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI484738B (zh) * 2009-04-28 2015-05-11 Semiconductor Components Ind 用於提供過電流保護的方法和電路
TWI549396B (zh) * 2011-04-25 2016-09-11 沃特拉半導體公司 用於監視電氣特性之系統、器件及程序
TWI553439B (zh) * 2012-03-23 2016-10-11 Sii Semiconductor Corp Semiconductor device
TWI711239B (zh) * 2019-12-27 2020-11-21 新唐科技股份有限公司 晶片以及其升溫電路與升溫控制方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7782586B2 (en) * 2007-08-22 2010-08-24 Symbol Technologies, Inc. Thermal management within mobile RFID readers through the application of temperature governed variable non-emissive intervals
TWI366758B (en) * 2008-12-18 2012-06-21 Inventec Corp Computer system and power control apparatus thereof
CN101588056B (zh) * 2009-03-11 2011-06-29 中国电子科技集团公司第二十四研究所 一种过热保护电路
US9787083B2 (en) 2012-12-06 2017-10-10 Twin-Star International, Inc. Overheat-resistant power cord and method
CN103124062B (zh) * 2013-01-16 2015-07-01 深圳怡化电脑股份有限公司 一种atm机间歇运行功率设备保护电路
CN103219769B (zh) * 2013-04-17 2015-12-02 广东欧珀移动通信有限公司 电池充电方法、电池充电系统及移动终端
EP2830218B1 (en) * 2013-07-23 2021-04-28 Infineon Technologies AG Thermal observer and overload protection for power switches
CN103746425B (zh) 2014-01-09 2016-02-17 成都芯源系统有限公司 移动电源电路及其方法
DE102015216809B4 (de) * 2015-09-02 2022-10-27 Dialog Semiconductor (UK) Ltd Energieversorgungsvorrichtung und Digitales Temperatursteuerverfahren für eine Energieversorgungsvorrichtung
US10490995B2 (en) * 2017-08-11 2019-11-26 Infineon Technologies Ag Current dependent thermal shutdown
US11493967B2 (en) * 2018-06-01 2022-11-08 Interdigital Madison Patent Holdings, Sas Thermal shutdown with hysteresis
AU2021202525B2 (en) * 2020-06-29 2022-07-14 Dongguan Poweramp Technology Limited Electrochemical apparatus, electrical apparatus, electric vehicle, and power supply control method
CN114625201A (zh) * 2022-03-08 2022-06-14 成都芯源系统有限公司 电压调节器的控制电路和控制方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3796943A (en) * 1973-01-02 1974-03-12 Nat Semiconductor Corp Current limiting circuit
KR100193736B1 (ko) * 1996-09-17 1999-06-15 윤종용 배터리 보호 기능을 갖는 배터리 팩
EP0985242A4 (en) * 1998-01-31 2007-12-12 John W Oglesbee OVERLOAD PROTECTION DEVICE AND METHOD FOR RECHARGEABLE LITHIUM BASE BATTERIES
US5977840A (en) * 1998-04-29 1999-11-02 Cts Corporation Circuit for minimizing turn-on time of temperature compensated crystal oscillator
CA2305887A1 (en) * 1999-04-21 2000-10-21 Arthur Descombes Protective circuit for battery
US6600641B2 (en) * 1999-10-22 2003-07-29 Motorola, Inc. Overcurrent protection for the series fuse
DE10392501T5 (de) * 2002-04-03 2006-04-20 International Rectifier Corp., El Segundo Verbesserungen eines synchronen Buck Converters
JP3783669B2 (ja) * 2002-08-29 2006-06-07 株式会社村田製作所 過熱保護回路

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI484738B (zh) * 2009-04-28 2015-05-11 Semiconductor Components Ind 用於提供過電流保護的方法和電路
TWI549396B (zh) * 2011-04-25 2016-09-11 沃特拉半導體公司 用於監視電氣特性之系統、器件及程序
US9679885B2 (en) 2011-04-25 2017-06-13 Volterra Semiconductor Corporation Integrated protection devices with monitoring of electrical characteristics
US10559559B2 (en) 2011-04-25 2020-02-11 Volterra Semiconductor Corporation Integrated protection devices with monitoring of electrical characteristics
TWI553439B (zh) * 2012-03-23 2016-10-11 Sii Semiconductor Corp Semiconductor device
TWI711239B (zh) * 2019-12-27 2020-11-21 新唐科技股份有限公司 晶片以及其升溫電路與升溫控制方法
US11967510B2 (en) 2019-12-27 2024-04-23 Nuvoton Technology Corporation Chip, heating circuit and heating control method for chip

Also Published As

Publication number Publication date
CN1917321B (zh) 2012-04-25
US20070052461A1 (en) 2007-03-08
CN1917321A (zh) 2007-02-21
TWI392184B (zh) 2013-04-01
US7420792B2 (en) 2008-09-02

Similar Documents

Publication Publication Date Title
TW200709527A (en) Thermal protection circuits, power delivery integrated circuits and power delivery methods
WO2008115608A3 (en) Method and apparatus for cooling integrated circuit chips using recycled power
TW200612340A (en) Task management method, task management device, semiconductor integrated circuit, electronic device, and task management system
FR2928056B1 (fr) Dispositif de protection d'un variateur de vitesse contre les surintensites.
MY176344A (en) Method and apparatus for inhibiting light-induced degradation of photovoltaic device
WO2009011879A3 (en) System and method for cooling an electronic device
MY161961A (en) Semiconductor wafer composed of monocrystalline silicon and method for producing it
SG142149A1 (en) Method of forming pid protection diode for soi wafer
TW200627213A (en) Integrated circuit selective scaling
TW200634497A (en) Method and apparatus to control temperature of processor
EP2487964A4 (en) ENERGY SAVING METHOD, SYSTEM AND BASE STATION
SG155152A1 (en) Integrated circuit system employing resistance altering techniques
MY150769A (en) Bis(aminophenol) derivative, process for producing the same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric, semiconductor device, and display element
TW200625627A (en) Method for recovery of hot carrier induced degradation in bipolar devices
TW200731418A (en) A semiconductor integrated circuit device and a manufacturing method for the same
MX2007007369A (es) Sistemas y metodos de enfriamiento de altos hornos.
TW200727449A (en) ESD protection system for multiple-domain integrated cirucit
TW200706809A (en) Cooker
TW200610479A (en) The method for controlling the fan speed by detecting different power sources of the mobile electronics device
EP1202336A4 (en) DEVICE FOR FORMING BUMPS ON ELECTRIC CHARGE GENERATOR SEMICONDUCTOR SUBSTRATE, METHOD FOR SUPPRESSING ELECTRIC CHARGE FROM ELECTRIC CHARGE SUBSTRATE, DEVICE FOR SUPPRESSING ELECTRIC CHARGE FROM ELECTRIC CHARGE GENERATOR SUBSTRATE AND SE SUBSTRATE
DE602004031430D1 (de) Elektronischer thermischer schutz für warmwasserbereiter
TW200715518A (en) Electrostatic discharge (ESD) protection apparatus for programmable device
TW200624625A (en) Washing machine and method for controlling supply of water thereof
SG96665A1 (en) An apparatus and method for cleaning glass substrates using a cool hydrogen flame
PL1965154T3 (pl) Urządzenie z pompą cieplną