TW200709444A - Package structure of photosensing device - Google Patents

Package structure of photosensing device

Info

Publication number
TW200709444A
TW200709444A TW094128323A TW94128323A TW200709444A TW 200709444 A TW200709444 A TW 200709444A TW 094128323 A TW094128323 A TW 094128323A TW 94128323 A TW94128323 A TW 94128323A TW 200709444 A TW200709444 A TW 200709444A
Authority
TW
Taiwan
Prior art keywords
photosensing device
package structure
wire
metal
metal wiring
Prior art date
Application number
TW094128323A
Other languages
Chinese (zh)
Inventor
bo-hong Chen
Original Assignee
Sigurd Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sigurd Microelectronics Corp filed Critical Sigurd Microelectronics Corp
Priority to TW094128323A priority Critical patent/TW200709444A/en
Publication of TW200709444A publication Critical patent/TW200709444A/en

Links

Landscapes

  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

A package structure of photosensing device is disclosed. The photosensing device is packaged by a base and a translucent layer. The photosensing device is electrically connected to the metal wiring on the base by metal wire-bonding. Also, by varying the position of the metal wiring, the connection point between the metal wire and the metal wiring is slightly higher than the top of the photosensing device, so that the wire-bonding distance of the metal wire is shortened, and the packaging area is further reduced.
TW094128323A 2005-08-19 2005-08-19 Package structure of photosensing device TW200709444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094128323A TW200709444A (en) 2005-08-19 2005-08-19 Package structure of photosensing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094128323A TW200709444A (en) 2005-08-19 2005-08-19 Package structure of photosensing device

Publications (1)

Publication Number Publication Date
TW200709444A true TW200709444A (en) 2007-03-01

Family

ID=57911054

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128323A TW200709444A (en) 2005-08-19 2005-08-19 Package structure of photosensing device

Country Status (1)

Country Link
TW (1) TW200709444A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7598580B1 (en) 2008-05-15 2009-10-06 Kingpak Technology Inc. Image sensor module package structure with supporting element
TWI826337B (en) * 2023-07-05 2023-12-11 力成科技股份有限公司 Image sensor package that keeps the glue from overflowing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7598580B1 (en) 2008-05-15 2009-10-06 Kingpak Technology Inc. Image sensor module package structure with supporting element
TWI826337B (en) * 2023-07-05 2023-12-11 力成科技股份有限公司 Image sensor package that keeps the glue from overflowing

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