TW200709444A - Package structure of photosensing device - Google Patents
Package structure of photosensing deviceInfo
- Publication number
- TW200709444A TW200709444A TW094128323A TW94128323A TW200709444A TW 200709444 A TW200709444 A TW 200709444A TW 094128323 A TW094128323 A TW 094128323A TW 94128323 A TW94128323 A TW 94128323A TW 200709444 A TW200709444 A TW 200709444A
- Authority
- TW
- Taiwan
- Prior art keywords
- photosensing device
- package structure
- wire
- metal
- metal wiring
- Prior art date
Links
Landscapes
- Light Receiving Elements (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
A package structure of photosensing device is disclosed. The photosensing device is packaged by a base and a translucent layer. The photosensing device is electrically connected to the metal wiring on the base by metal wire-bonding. Also, by varying the position of the metal wiring, the connection point between the metal wire and the metal wiring is slightly higher than the top of the photosensing device, so that the wire-bonding distance of the metal wire is shortened, and the packaging area is further reduced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094128323A TW200709444A (en) | 2005-08-19 | 2005-08-19 | Package structure of photosensing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094128323A TW200709444A (en) | 2005-08-19 | 2005-08-19 | Package structure of photosensing device |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200709444A true TW200709444A (en) | 2007-03-01 |
Family
ID=57911054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094128323A TW200709444A (en) | 2005-08-19 | 2005-08-19 | Package structure of photosensing device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200709444A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7598580B1 (en) | 2008-05-15 | 2009-10-06 | Kingpak Technology Inc. | Image sensor module package structure with supporting element |
TWI826337B (en) * | 2023-07-05 | 2023-12-11 | 力成科技股份有限公司 | Image sensor package that keeps the glue from overflowing |
-
2005
- 2005-08-19 TW TW094128323A patent/TW200709444A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7598580B1 (en) | 2008-05-15 | 2009-10-06 | Kingpak Technology Inc. | Image sensor module package structure with supporting element |
TWI826337B (en) * | 2023-07-05 | 2023-12-11 | 力成科技股份有限公司 | Image sensor package that keeps the glue from overflowing |
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