TW200708509A - Method of preparing epoxy compound and curable epoxy resin compound - Google Patents

Method of preparing epoxy compound and curable epoxy resin compound

Info

Publication number
TW200708509A
TW200708509A TW095114037A TW95114037A TW200708509A TW 200708509 A TW200708509 A TW 200708509A TW 095114037 A TW095114037 A TW 095114037A TW 95114037 A TW95114037 A TW 95114037A TW 200708509 A TW200708509 A TW 200708509A
Authority
TW
Taiwan
Prior art keywords
compound
preparing
epoxy compound
epoxy resin
epoxy
Prior art date
Application number
TW095114037A
Other languages
Chinese (zh)
Inventor
Katsuya Maruo
Hideyuki Takai
Original Assignee
Daicel Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chem filed Critical Daicel Chem
Publication of TW200708509A publication Critical patent/TW200708509A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/48—Compounds containing oxirane rings with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, directly attached to ring carbon atoms, e.g. ester or nitrile radicals
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D301/00—Preparation of oxiranes
    • C07D301/02—Synthesis of the oxirane ring
    • C07D301/03—Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds
    • C07D301/14—Synthesis of the oxirane ring by oxidation of unsaturated compounds, or of mixtures of unsaturated and saturated compounds with organic peracids, or salts, anhydrides or esters thereof
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/16—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

The present invention relates to a method of producing epoxy compound, a curable epoxy resin compound which form by an epoxy compound made through the said method and a curing agent or a curing catalyst. The said method of preparing epoxy compound is characterized in that add organic solvent solution containing percarboxylic acid of 25 to 35 wt% to epoxyidize the olefin compound represented by the following formula (1) to obtain the epoxy compound represented by the following formula (2). According to the method of preparing epoxy compound, a curable epoxy resin compound which has excellent curing property while promoting the yield and purity greatly is obtained.
TW095114037A 2005-04-21 2006-04-20 Method of preparing epoxy compound and curable epoxy resin compound TW200708509A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005123661 2005-04-21

Publications (1)

Publication Number Publication Date
TW200708509A true TW200708509A (en) 2007-03-01

Family

ID=37214638

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114037A TW200708509A (en) 2005-04-21 2006-04-20 Method of preparing epoxy compound and curable epoxy resin compound

Country Status (3)

Country Link
JP (1) JPWO2006115011A1 (en)
TW (1) TW200708509A (en)
WO (1) WO2006115011A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5832821B2 (en) * 2011-08-18 2015-12-16 株式会社ダイセル Epoxy compound and method for producing the same
CN109232480A (en) * 2018-10-15 2019-01-18 大连理工大学 A kind of acid controlled degradation type cycloaliphatic epoxy resin and preparation method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL127409C (en) * 1959-03-05
US6570029B2 (en) * 2000-03-29 2003-05-27 Georgia Tech Research Corp. No-flow reworkable epoxy underfills for flip-chip applications

Also Published As

Publication number Publication date
JPWO2006115011A1 (en) 2008-12-18
WO2006115011A1 (en) 2006-11-02

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