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Application filed by Himax Tech IncfiledCriticalHimax Tech Inc
Priority to TW94127232ApriorityCriticalpatent/TWI358744B/en
Publication of TW200707534ApublicationCriticalpatent/TW200707534A/en
Application grantedgrantedCritical
Publication of TWI358744BpublicationCriticalpatent/TWI358744B/en
Container, Conveyance, Adherence, Positioning, Of Wafer
(AREA)
Abstract
A chip tray is provided. The chip tray includes a plurality of containments for containing a plurality of chips. Each of the plurality of containments includes a bottom portion and defines at least one hole. The bottom portion has a protrusion for contacting the chip.