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Application filed by Advanced Semiconductor EngfiledCriticalAdvanced Semiconductor Eng
Priority to TW094126505ApriorityCriticalpatent/TWI368934B/en
Publication of TW200707522ApublicationCriticalpatent/TW200707522A/en
Application grantedgrantedCritical
Publication of TWI368934BpublicationCriticalpatent/TWI368934B/en
An apparatus and a method for forming metal balls are provided. The apparatus includes a heating trough and a mold, wherein the heating trough has a chamber and the bottom of the heating trough has a plurality of injecting openings. In addition, the mold is disposed under the heating trough and has a plurality of cavities corresponding to the injecting openings. The method for forming metal balls first provides a metal material into the chamber and melts the metal material by the heating trough. Then, the metal material in the chamber is injected into the cavities of the mold via the injecting openings to form a plurality of metal balls in the cavities.
TW094126505A2005-08-042005-08-04Apparatus and method for forming metal balls
TWI368934B
(en)