TW200706698A - Apparatus for etching a glass substrate - Google Patents

Apparatus for etching a glass substrate

Info

Publication number
TW200706698A
TW200706698A TW095129172A TW95129172A TW200706698A TW 200706698 A TW200706698 A TW 200706698A TW 095129172 A TW095129172 A TW 095129172A TW 95129172 A TW95129172 A TW 95129172A TW 200706698 A TW200706698 A TW 200706698A
Authority
TW
Taiwan
Prior art keywords
glass substrate
etching
rollers
container
etching solution
Prior art date
Application number
TW095129172A
Other languages
English (en)
Inventor
Gi-Won Lee
Seung-Ju Choi
Myung-Won Kang
Kwang-Ju Sung
Original Assignee
Jiwontech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060071851A external-priority patent/KR100773786B1/ko
Application filed by Jiwontech Co Ltd filed Critical Jiwontech Co Ltd
Publication of TW200706698A publication Critical patent/TW200706698A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Surface Treatment Of Glass (AREA)
  • Weting (AREA)
TW095129172A 2005-08-12 2006-08-09 Apparatus for etching a glass substrate TW200706698A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20050074268 2005-08-12
KR1020060071851A KR100773786B1 (ko) 2005-08-12 2006-07-31 유리 기판의 식각 장치

Publications (1)

Publication Number Publication Date
TW200706698A true TW200706698A (en) 2007-02-16

Family

ID=37743056

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129172A TW200706698A (en) 2005-08-12 2006-08-09 Apparatus for etching a glass substrate

Country Status (3)

Country Link
US (1) US20070037358A1 (zh)
JP (1) JP2007053361A (zh)
TW (1) TW200706698A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI829673B (zh) * 2018-03-07 2024-01-21 美商康寧公司 玻璃基板黏接控制

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080217296A1 (en) * 2007-03-07 2008-09-11 United Microelectronics Corp. Etching apparatus for semiconductor processing apparatus and method thereof for recycling etchant solutions
US20120308346A1 (en) * 2011-06-03 2012-12-06 Arthur Keigler Parallel single substrate processing system loader
KR101806918B1 (ko) * 2012-08-16 2017-12-08 한화테크윈 주식회사 그래핀의 촉매 금속 제거 장치
KR101815680B1 (ko) * 2012-08-17 2018-01-05 한화테크윈 주식회사 그래핀의 촉매 금속 제거 장치
CN112387732B (zh) * 2020-10-26 2021-10-22 深圳市泰源兴光电科技有限公司 一种用于触控面板制造的预处理系统
CN114050118B (zh) * 2021-11-20 2022-08-16 深圳祺芯通半导体有限公司 一种半导体加工用ito玻璃电极图形酸洗蚀刻设备
CN114656158A (zh) * 2022-04-26 2022-06-24 翔实光电科技(昆山)有限公司 一种抛光ag玻璃的装置、抛光方法及移载装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100202191B1 (ko) * 1996-07-18 1999-06-15 문정환 반도체 웨이퍼 습식 처리장치
US6070284A (en) * 1998-02-04 2000-06-06 Silikinetic Technology, Inc. Wafer cleaning method and system
US6625835B1 (en) * 1999-05-27 2003-09-30 Lam Research Corporation Disk cascade scrubber
JP3810968B2 (ja) * 1999-12-03 2006-08-16 東京エレクトロン株式会社 液処理装置および液処理方法
US6673195B2 (en) * 2001-03-30 2004-01-06 Industrial Technologies Research Institute Apparatus and method for etching glass panels
US20020166569A1 (en) * 2001-05-10 2002-11-14 Speedfam-Ipec Corporation Method and apparatus for semiconductor wafer cleaning

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI829673B (zh) * 2018-03-07 2024-01-21 美商康寧公司 玻璃基板黏接控制

Also Published As

Publication number Publication date
JP2007053361A (ja) 2007-03-01
US20070037358A1 (en) 2007-02-15

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