TW200706680A - Method and apparatus for sputtering onto large flat panels - Google Patents
Method and apparatus for sputtering onto large flat panelsInfo
- Publication number
- TW200706680A TW200706680A TW095126272A TW95126272A TW200706680A TW 200706680 A TW200706680 A TW 200706680A TW 095126272 A TW095126272 A TW 095126272A TW 95126272 A TW95126272 A TW 95126272A TW 200706680 A TW200706680 A TW 200706680A
- Authority
- TW
- Taiwan
- Prior art keywords
- target
- magnetron
- rectangular
- scan
- large flat
- Prior art date
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
A rectangular magnetron placed at the back of a rectangular target to intensify the plasma in a sputter reactor configured for sputtering target material onto a rectangular panel. The magnetron has a size only somewhat less than that of the target and is scanned in the two perpendicular directions of the target with a scan length of, for example, about 100mm for a 2m target. The scan may follow a double-Z pattern along two links parallel to a target side and the two connecting diagonals. The magnetron includes a closed plasma loop formed in a convolute shape, for example, a folded shape or a rectangularized helix with an inner pole of nearly constant width extending along a single path and having one magnetic polarity completely surrounded by an outer pole having the opposed polarity. External actuators move the magnetron slidably suspended from a gantry which sliding perpendicularly on the chamber walls.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70232705P | 2005-07-25 | 2005-07-25 | |
US70503105P | 2005-08-02 | 2005-08-02 | |
US11/211,141 US20060049040A1 (en) | 2004-01-07 | 2005-08-24 | Apparatus and method for two dimensional magnetron scanning for sputtering onto flat panels |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200706680A true TW200706680A (en) | 2007-02-16 |
TWI363103B TWI363103B (en) | 2012-05-01 |
Family
ID=46750615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95126272A TWI363103B (en) | 2005-07-25 | 2006-07-18 | Method and apparatus for sputtering onto large flat panels |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI363103B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI387399B (en) * | 2007-11-30 | 2013-02-21 | Applied Materials Inc | Control of arbitrary scan path of a rotating magnetron |
-
2006
- 2006-07-18 TW TW95126272A patent/TWI363103B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI387399B (en) * | 2007-11-30 | 2013-02-21 | Applied Materials Inc | Control of arbitrary scan path of a rotating magnetron |
Also Published As
Publication number | Publication date |
---|---|
TWI363103B (en) | 2012-05-01 |
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