TW200706265A - Coating method, coating apparatus and manufacturing method for photo mask blank - Google Patents

Coating method, coating apparatus and manufacturing method for photo mask blank

Info

Publication number
TW200706265A
TW200706265A TW095112393A TW95112393A TW200706265A TW 200706265 A TW200706265 A TW 200706265A TW 095112393 A TW095112393 A TW 095112393A TW 95112393 A TW95112393 A TW 95112393A TW 200706265 A TW200706265 A TW 200706265A
Authority
TW
Taiwan
Prior art keywords
coating
nozzle
substrate
manufacturing
mask blank
Prior art date
Application number
TW095112393A
Other languages
Chinese (zh)
Inventor
Michiaki Sano
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of TW200706265A publication Critical patent/TW200706265A/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

There is provided a coating method which uses a coating apparatus 10 for coating a coating liquid on a surface 28A of a substrate 28 by contacting the coating liquid reached a tip opening through a nozzle 82 of a coating system 30 with the surface 28A, and then moving the substrate relative to the nozzle, to thereby form a coating film. In the coating method, scanning speed of the substrate relative to the nozzle is corrected for each of coating regions of the surface along relative scanning direction between the substrate and the nozzle such that the thickness of the coating film formed in each of the coating regions is within a predetermined range, in accordance with a correlation between the coated film thickness and the scanning speed and film thickness data for each of the coating regions of the coating film formed previously before along the scanning direction.
TW095112393A 2005-04-08 2006-04-07 Coating method, coating apparatus and manufacturing method for photo mask blank TW200706265A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005112794A JP4260135B2 (en) 2005-04-08 2005-04-08 Resist coating method, resist coating apparatus, and photomask blank manufacturing method

Publications (1)

Publication Number Publication Date
TW200706265A true TW200706265A (en) 2007-02-16

Family

ID=37410432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112393A TW200706265A (en) 2005-04-08 2006-04-07 Coating method, coating apparatus and manufacturing method for photo mask blank

Country Status (3)

Country Link
JP (1) JP4260135B2 (en)
KR (1) KR101012552B1 (en)
TW (1) TW200706265A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101145562B1 (en) * 2008-04-10 2012-05-15 호야 가부시키가이샤 Manufacturing method of photomask blank, and manufacturing method of photomask
JP5377881B2 (en) * 2008-04-10 2013-12-25 Hoya株式会社 Photomask blank manufacturing method and photomask manufacturing method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1157587A (en) * 1997-08-22 1999-03-02 Dainippon Screen Mfg Co Ltd Coating device
KR100521060B1 (en) * 1998-11-12 2005-12-30 엘지전자 주식회사 Nozzle structure of substrate coating equipment and its control method
JP2005051220A (en) * 2003-07-17 2005-02-24 Hoya Corp Method for manufacturing substrate with resist film

Also Published As

Publication number Publication date
KR101012552B1 (en) 2011-02-07
JP4260135B2 (en) 2009-04-30
JP2006289252A (en) 2006-10-26
KR20060107377A (en) 2006-10-13

Similar Documents

Publication Publication Date Title
EP1854909A3 (en) Coating structure and method for forming the same
ATE404621T1 (en) METHOD FOR APPLYING A COATING TO A SURFACE OF A LENS SUBSTRATE
SG131773A1 (en) Method of dividing a non-metal substrate
DE602005025138D1 (en) METHOD FOR PRODUCING A MICRONADEL OR A MICROIMPLANTATE
WO2007130417A3 (en) Barrier coatings for films and structures
WO2008048928A3 (en) Methods of patterning a material on polymeric substrates
EP1811337A3 (en) Pattern forming method and pattern forming system
TW200644075A (en) Method of forming film pattern, film pattern, device, electro optic device, and electronic apparatus background of the invention
ATE452220T1 (en) METHOD FOR DEPOSITING INORGANIC/ORGANIC FILM
WO2008022254A3 (en) Vehicle structure with three dimensional film and method
MY139627A (en) Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer
TW200735180A (en) Manufacturing method of semiconductor device
TW200504798A (en) Substrate, device, method of manufacturing device, method of manufacturing active-matrix substrate, electrooptical apparatus and electronic apparatus
WO2007106885A3 (en) Photographic printing paper and method of making same
TW200705113A (en) Exposure method, exposure apparatus, method for manufacturing device, and film evaluation method
ATE431963T1 (en) DEVICE AND METHOD FOR SURFACE TREATMENT OF SUBSTRATES
TW200615389A (en) Film forming method, electronic device and electronic apparatus
WO2008149776A1 (en) Method for producing substrate with partition wall and pixel formed thereon
EA201290598A1 (en) DEVICE AND METHOD FOR COVERING SUBSTRATES
TW200703454A (en) Slit nozzle, substrate processing apparatus, and substrate processing method
WO2008123049A1 (en) Method for film formation, resin composition for use in the method, structure having insulating film, process for producing the structure, and electronic component
TW200706265A (en) Coating method, coating apparatus and manufacturing method for photo mask blank
TW200502434A (en) Adhesive layer forming method
WO2008096866A1 (en) Photocatalyst thin film, method for forming photocatalyst thin film, and photocatalyst thin film coated product
WO2008017740A3 (en) Method of applying a coating to a face of a lens and apparatus for the implementation of such a method