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Application filed by Advanced Semiconductor EngfiledCriticalAdvanced Semiconductor Eng
Priority to TW94125068ApriorityCriticalpatent/TWI281698B/en
Publication of TW200705526ApublicationCriticalpatent/TW200705526A/en
Application grantedgrantedCritical
Publication of TWI281698BpublicationCriticalpatent/TWI281698B/en
Production Of Multi-Layered Print Wiring Board
(AREA)
Wire Bonding
(AREA)
Abstract
A chip package including a circuit substrate, a chip, solder balls, first heat conductive plugs and second heat conductive plugs is provided. The circuit substrate has a carrying surface and a back surface corresponding thereto. The circuit substrate includes two conductive outer layers and at least one conductive inner layer disposed between the two conductive outer layers. The thickness of the conductive inner layer is greater than that of each conductive outer layer. In addition, the chip is disposed on and electrically connected to the circuit substrate. Moreover, the solder balls are disposed on the back surface. The first and the second heat conductive plugs are disposed in the circuit substrate, wherein the first heat conductive plugs are connected between the chip and the conductive inner layer and the second conductive plugs are connected between the conductive inner layer and the solder balls.