TW200704663A - Radiation-curable resin composition and, article and molding using the same - Google Patents

Radiation-curable resin composition and, article and molding using the same

Info

Publication number
TW200704663A
TW200704663A TW095114040A TW95114040A TW200704663A TW 200704663 A TW200704663 A TW 200704663A TW 095114040 A TW095114040 A TW 095114040A TW 95114040 A TW95114040 A TW 95114040A TW 200704663 A TW200704663 A TW 200704663A
Authority
TW
Taiwan
Prior art keywords
radiation
resin composition
curable resin
meth
functional group
Prior art date
Application number
TW095114040A
Other languages
Chinese (zh)
Other versions
TWI363766B (en
Inventor
Naoto Kidokoro
Nobuyuki Koike
Shigetoshi Nishizawa
Toshiyuki Kiyonari
Original Assignee
Dainippon Ink & Chemicals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink & Chemicals filed Critical Dainippon Ink & Chemicals
Publication of TW200704663A publication Critical patent/TW200704663A/en
Application granted granted Critical
Publication of TWI363766B publication Critical patent/TWI363766B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/06—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09D175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films

Abstract

A radiation-curable resin composition of the present invention includes a urethane acrylate (A) which is an additionally reacted material of a polyisocyanate (a1) and an acrylate (a2) having one hydroxyl group and two or more (meth)acryloyl groups per molecule; and a polymer (B) having a (meth)acryloyl group obtained by reacting a (meth)acrylate polymer (b1l) having a reactive functional group at a side chain and an α,β-unsaturated compound (b2) having a functional group that is capable of reacting with the reactive functional group. According to the present invention, it is possible to obtain a cured film in which the occurrence of curing shrinkage is small, hardness is high, and abrasion-resistance is high when the radiation-curable resin composition is cured on exposure to radiation such as ultraviolet rays.
TW095114040A 2005-04-25 2006-04-20 Radiation-curable resin composition for film protective layer and, molding using the same TWI363766B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005126363 2005-04-25

Publications (2)

Publication Number Publication Date
TW200704663A true TW200704663A (en) 2007-02-01
TWI363766B TWI363766B (en) 2012-05-11

Family

ID=37214708

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114040A TWI363766B (en) 2005-04-25 2006-04-20 Radiation-curable resin composition for film protective layer and, molding using the same

Country Status (4)

Country Link
KR (1) KR100864349B1 (en)
CN (1) CN101203537A (en)
TW (1) TWI363766B (en)
WO (1) WO2006115085A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475081B (en) * 2012-05-08 2015-03-01 Lg Hausys Ltd Coating composition, method of manufacturing the coating composition and transfer shteet using the coating composition

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011034035A1 (en) * 2009-09-18 2013-02-14 Dic株式会社 Active energy ray-curable resin composition, cured product and film thereof
KR101802215B1 (en) * 2010-03-31 2017-11-28 디아이씨 가부시끼가이샤 Active energy ray-curable resin composition and cured product and film thereof
US20140004367A1 (en) * 2010-12-22 2014-01-02 Dic Corporation Method for producing dispersion, dispersion, coating material, coating film, and film
JP6057121B2 (en) * 2012-11-02 2017-01-11 Dic株式会社 Active energy ray curable composition, cured product thereof and article having cured coating film thereof
JP6071108B2 (en) * 2013-03-13 2017-02-01 荒川化学工業株式会社 Photocurable resin composition and optical film obtained using the same
CN104129189B (en) * 2013-05-02 2017-09-29 荒川化学工业株式会社 Transfer decorating film
KR101813024B1 (en) * 2013-11-11 2017-12-28 디아이씨 가부시끼가이샤 Active energy ray-curable composition, cured product thereof, and article having cured coating film thereof
JP5977776B2 (en) * 2014-03-12 2016-08-24 富士フイルム株式会社 Barrier laminate, gas barrier film, laminate film, and infusion bag
TWI681997B (en) * 2014-06-13 2020-01-11 日商東亞合成股份有限公司 Hardened composition
JP7218998B2 (en) * 2015-02-06 2023-02-07 三菱瓦斯化学株式会社 Curable resin composition, cured product and laminate
KR102056113B1 (en) * 2015-04-10 2019-12-16 후지필름 가부시키가이샤 Transparent film, polarizing plate, and image display device
WO2016208785A1 (en) * 2015-06-24 2016-12-29 삼성전자 주식회사 Hard coating film for display device and display device comprising same
JP2021116374A (en) * 2020-01-28 2021-08-10 荒川化学工業株式会社 Undercoat agent, cured product, and laminate
CN113801291B (en) * 2021-04-27 2023-05-12 杭州福斯特电子材料有限公司 Photosensitive resin composition, photosensitive dry film resist and manufacturing method of PCB

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4212704B2 (en) * 1998-01-14 2009-01-21 株式会社日本触媒 (Meth) acrylic resin composition and cured product thereof
JP2000241970A (en) * 1998-12-25 2000-09-08 Mitsubishi Chemicals Corp Photosensitive composition and photosensitive printing plate
JP2001290267A (en) * 2000-02-01 2001-10-19 Mitsubishi Chemicals Corp Photopolymerizable composition, photosensitive planographic printing plate and method for producing printing plate
JP3687514B2 (en) * 2000-10-05 2005-08-24 東亞合成株式会社 Curable composition
JP2003122002A (en) * 2001-10-18 2003-04-25 Mitsubishi Chemicals Corp Photopolymerizable composition, photosensitive lithographic printing plate, and method for making printing plate
JP3771844B2 (en) * 2002-01-10 2006-04-26 互応化学工業株式会社 Photosensitive resin composition, photo solder resist ink, printed wiring board and dry film
JP2003315990A (en) * 2002-04-25 2003-11-06 Mitsubishi Chemicals Corp Image forming material and image forming method
JP4415797B2 (en) * 2004-08-31 2010-02-17 日立化成工業株式会社 Photocurable resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI475081B (en) * 2012-05-08 2015-03-01 Lg Hausys Ltd Coating composition, method of manufacturing the coating composition and transfer shteet using the coating composition
US9267055B2 (en) 2012-05-08 2016-02-23 Lg Hausys, Ltd. Coating composition with excellent tactile characteristics, preparation method thereof, and transfer sheet using same

Also Published As

Publication number Publication date
TWI363766B (en) 2012-05-11
WO2006115085A1 (en) 2006-11-02
CN101203537A (en) 2008-06-18
KR100864349B1 (en) 2008-10-17
KR20070120177A (en) 2007-12-21

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